The aerospace and electronics industries have an ever increasing need for higher performance materials. In recent years, linear aromatic polyimides have been proven to be a superior class of materials for various applications in these industries. The use of this class of polymers as adhesives is continuing to increase. Several NASA Langley developed polyimides show considerable promise as adhesives because of their high glass transition temperatures, thermal stability, resistance to solvents/water, and their potential for cost effective manufacture
Spacecraft and aerospace engines share a common threat: high temperature. The temperatures experienc...
High temperature polyimide film and adhesive materials for spacecraft electrical equipmen
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
Future civilian aircraft will require the use of advanced adhesive systems with high temperature cap...
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high te...
A new linear, aromatic, thermoplastic polyimide, prepared from oxydiphthalic anhydride (ODPA) and 3,...
An addition polyimide adhesive, LARC 13, was developed which shows promise for bonding both titanium...
High bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no...
Thermoplastic polyimides were prepared and evaluated as adhesives. These materials are based on 4,4'...
A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quan...
High temperature structural resins are required for use on advanced aerospace vehicles as adhesives ...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Experimental polyimide resins were developed and evaluated as potential high temperature adhesives f...
The preliminary evaluation of crosslinked polyphenyl quinoxaline (X-PPQ), LARC-TPI, ethyl terminated...
Spacecraft and aerospace engines share a common threat: high temperature. The temperatures experienc...
High temperature polyimide film and adhesive materials for spacecraft electrical equipmen
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
Future civilian aircraft will require the use of advanced adhesive systems with high temperature cap...
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high te...
A new linear, aromatic, thermoplastic polyimide, prepared from oxydiphthalic anhydride (ODPA) and 3,...
An addition polyimide adhesive, LARC 13, was developed which shows promise for bonding both titanium...
High bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no...
Thermoplastic polyimides were prepared and evaluated as adhesives. These materials are based on 4,4'...
A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quan...
High temperature structural resins are required for use on advanced aerospace vehicles as adhesives ...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Experimental polyimide resins were developed and evaluated as potential high temperature adhesives f...
The preliminary evaluation of crosslinked polyphenyl quinoxaline (X-PPQ), LARC-TPI, ethyl terminated...
Spacecraft and aerospace engines share a common threat: high temperature. The temperatures experienc...
High temperature polyimide film and adhesive materials for spacecraft electrical equipmen
A series of polyimides containing silicone elastomers was synthesized in order to study the effects ...