Boiling Heat Transfer Mechanisms in Earth and Low Gravity: Boundary Condition and Heater Aspect Ratio Effects

Boiling is a complex phenomenon where hydrodynamics, heat transfer, mass transfer, and interfacial phenomena are tightly interwoven. An understanding of boiling and critical heat flux in microgravity environments is of importance to space based hardware and processes such as heat exchange, cryogenic fuel storage and transportation, electronic cooling, and material processing due to the large amounts of heat that can be removed with relatively little increase in temperature. Although research in this area has been performed in the past four decades, the mechanisms by which heat is removed from surfaces in microgravity are still unclear. Recently, time and space resolved heat transfer data were obtained in both earth and low gravity environments using an array of microheaters varying in size between 100 microns to 700 microns. These heaters were operated in both constant temperature as well as constant heat flux mode. Heat transfer under nucleating bubbles in earth gravity were directly measured using a microheater array with 100 m resolution operated in constant temperature mode with low and high subcooled bulk liquid along with images from below and from the side. The individual bubble departure diameter and energy transfer were larger with low subcooling but the departure frequency increased at high subcooling, resulting in higher overall heat transfer. The bubble growth for both subcoolings was primarily due to energy transfer from the superheated liquid layer relatively little was due to wall heat transfer during the bubble growth process. Oscillating bubbles and sliding bubbles were also observed in highly subcooled boiling. Transient conduction and/or microconvection was the dominant heat transfer mechanism in the above cases. A transient conduction model was developed and compared with the experimental data with good agreement. Data was also obtained with the heater array operated in a constant heat flux mode and measuring the temperature distribution across the array during boiling. The instantaneous heat transfer into the substrate was numerically determined and subtracted from the supplied heat to obtain the wall to liquid heat flux