A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling active devices. The model is applied to the non-isothermal simulation of pseudomorphic high electron mobility transistors (pHEMTs). A large-scale surface temperature model is described which allows thermal modelling of semiconductor devices and monolithic circuits. An example of the application of thermal modelling to monolithic circuit characterization is given
A fully physical electro-thermal model is described. It combines the fast, quasi-2-dimensional Leeds...
This works describes the use of electro-thermal numerical simulations for the design, modeling, and ...
The electrical characteristics of modern VLSI and ULSI device structures may be significantly altere...
A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling acti...
A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling acti...
The first completely physical electro-thermal model is presented that is capable of describing the l...
The temperature-dependent thermal conductivities of a GaAs pseudomorphic high-electron mobility tran...
Nonisothermal steady-state and transient simulation capabilities have been implemented in the ATLAS ...
The development of power electronics in the field of transportations (automotive, aeronautics) requi...
Results are presented for the first fully physical, time-dependent, coupled electro-thermal simulati...
This contribution derives an efficient approach to model a coupled electro-thermal design problem fo...
This paper deals with using device-level numerical simulations for the investigation of the electro-...
With the ever increasing integration density of electronic circuits and devices thermal issues due t...
In the paper the problem of modelling thermal properties of semiconductor devices with the use of co...
This paper demonstrates a practical approach to developing a geometrically scalable thermal resistan...
A fully physical electro-thermal model is described. It combines the fast, quasi-2-dimensional Leeds...
This works describes the use of electro-thermal numerical simulations for the design, modeling, and ...
The electrical characteristics of modern VLSI and ULSI device structures may be significantly altere...
A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling acti...
A fully coupled electro-thermal hydrodynamic model is described which is suitable for modelling acti...
The first completely physical electro-thermal model is presented that is capable of describing the l...
The temperature-dependent thermal conductivities of a GaAs pseudomorphic high-electron mobility tran...
Nonisothermal steady-state and transient simulation capabilities have been implemented in the ATLAS ...
The development of power electronics in the field of transportations (automotive, aeronautics) requi...
Results are presented for the first fully physical, time-dependent, coupled electro-thermal simulati...
This contribution derives an efficient approach to model a coupled electro-thermal design problem fo...
This paper deals with using device-level numerical simulations for the investigation of the electro-...
With the ever increasing integration density of electronic circuits and devices thermal issues due t...
In the paper the problem of modelling thermal properties of semiconductor devices with the use of co...
This paper demonstrates a practical approach to developing a geometrically scalable thermal resistan...
A fully physical electro-thermal model is described. It combines the fast, quasi-2-dimensional Leeds...
This works describes the use of electro-thermal numerical simulations for the design, modeling, and ...
The electrical characteristics of modern VLSI and ULSI device structures may be significantly altere...