Add to ORKGGold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors
New wide-band gap semiconductors (SC) for power electronics such as SiC, GaN and diamond will allow ...
Electronic applications are described that would benefit from the availability of high temperature s...
This work describes recent progress in the design, processing, upscaling, and testing of 500C durabl...
NASA space and aeronautical missions for probing the inner solar planets as well as for in situ moni...
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in d...
High-temperature environment operable sensors and electronics are required for exploring the inner s...
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in d...
High-temperature environment operable sensors and electronics are required for long-term exploration...
A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at te...
A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide ...
A series of ceramic substrates and thick-film metalization-based prototype microsystem packages desi...
High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical ...
Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating...
This dissertation research focused on the synthesis and application of ceramic paste for high-temper...
This dissertation research focused on the synthesis and application of ceramic paste for high-temper...
New wide-band gap semiconductors (SC) for power electronics such as SiC, GaN and diamond will allow ...
Electronic applications are described that would benefit from the availability of high temperature s...
This work describes recent progress in the design, processing, upscaling, and testing of 500C durabl...
NASA space and aeronautical missions for probing the inner solar planets as well as for in situ moni...
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in d...
High-temperature environment operable sensors and electronics are required for exploring the inner s...
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in d...
High-temperature environment operable sensors and electronics are required for long-term exploration...
A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at te...
A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide ...
A series of ceramic substrates and thick-film metalization-based prototype microsystem packages desi...
High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical ...
Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating...
This dissertation research focused on the synthesis and application of ceramic paste for high-temper...
This dissertation research focused on the synthesis and application of ceramic paste for high-temper...
New wide-band gap semiconductors (SC) for power electronics such as SiC, GaN and diamond will allow ...
Electronic applications are described that would benefit from the availability of high temperature s...
This work describes recent progress in the design, processing, upscaling, and testing of 500C durabl...