Abstract: The paper presents results which demonstrate that radiated emissions from heatsinks are reduced by an amount that depends upon the distribution and impedance of the grounding structure. Results are also presented which show the effect on radiated emissions of the presence of conductors (e.g. PCB tracks) passing under the heatsink. The presence of conductors reduces the effectiveness of the heatsink grounding but, in most case, emissions at high frequencies do not exceed those without conductors attached
The thesis consists of two sections. Section 1 of the thesis describes a method for detecting and id...
EMI problems caused by the presence of heatpipe/heatspreader and heatsink structures in a high-speed...
The ability of an enclosure to protect its contents from electromagnetic interference is quantified ...
Abstract: The paper presents results which demonstrate that radiated emissions from heatsinks are re...
The paper presents results which demonstrate that radiated emissions from heatsinks are reduced by a...
One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involv...
Electromagnetic Compatibility (EMC) problems may occur in many environments. This Thesis considers a...
Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) ...
Heatsinks may cause radiated emission and radio frequency interference problems when they are mounte...
The paper presents a numerical method based on Finite Difference Time Domain (FDTD) in both frequenc...
This paper describes a study on the effectiveness of grounding pins and high-frequency absorbers to ...
Knowledge of the Absorption Cross Section (ACS) of a Printed Circuit Board (PCB) is essential when d...
A hybrid modeling technique using the Finite-Difference Time-Domain (FDTD) approach in conjunction w...
Due to their size and complex geometry, large heatsinks such as those used in the power electronics ...
Signal voltages and currents in integrated circuits (ICs) and on printed circuit board (PCB) traces ...
The thesis consists of two sections. Section 1 of the thesis describes a method for detecting and id...
EMI problems caused by the presence of heatpipe/heatspreader and heatsink structures in a high-speed...
The ability of an enclosure to protect its contents from electromagnetic interference is quantified ...
Abstract: The paper presents results which demonstrate that radiated emissions from heatsinks are re...
The paper presents results which demonstrate that radiated emissions from heatsinks are reduced by a...
One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involv...
Electromagnetic Compatibility (EMC) problems may occur in many environments. This Thesis considers a...
Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) ...
Heatsinks may cause radiated emission and radio frequency interference problems when they are mounte...
The paper presents a numerical method based on Finite Difference Time Domain (FDTD) in both frequenc...
This paper describes a study on the effectiveness of grounding pins and high-frequency absorbers to ...
Knowledge of the Absorption Cross Section (ACS) of a Printed Circuit Board (PCB) is essential when d...
A hybrid modeling technique using the Finite-Difference Time-Domain (FDTD) approach in conjunction w...
Due to their size and complex geometry, large heatsinks such as those used in the power electronics ...
Signal voltages and currents in integrated circuits (ICs) and on printed circuit board (PCB) traces ...
The thesis consists of two sections. Section 1 of the thesis describes a method for detecting and id...
EMI problems caused by the presence of heatpipe/heatspreader and heatsink structures in a high-speed...
The ability of an enclosure to protect its contents from electromagnetic interference is quantified ...