The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fins lie between those for plate fins (high aspect ratio) and pins fins (aspect ratio≈ 1) are explored computationally, using a conjugate heat transfer model. Results show that strip fins provide another effective means of enhancing heat transfer, especially when staggered arrangements of strip fins are used. A detailed parameter investigation demonstrates that perforating the strip fins provide additional improvements in terms of enhanced heat transfer, together with reduced pressure loss and heat sink mass. Results are also given which show that, for practical applications in micro-electronics cooling, perforated SFHSs offer important benefits...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
Recent development era in technology has huge requirement of high performance lightweight, and compa...
The importance of accounting for the temperature dependence of air properties in numerical simulatio...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
The benefits of using notch, slot and multiple circular perforations in plate fin heat sinks (PFHSs)...
The benefits of using pin fin heat sinks with multiple perforations are investigated using complemen...
The benefits of using pin heat sinks (PHSs) with single, rectangular slotted or notched pin perforat...
The official published version of this article can be found at the link below.This paper provides a ...
AbstractMicro heat sinks are adopted in electronics cooling together with different technologies to ...
Experiments were conducted to investigate forced convective cooling performance of an air cooled par...
© Springer Nature Singapore Pte Ltd. 2018. The development of semiconductor fabrication process and ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The performance of impingement air cooled plate fin heat sinks differs significantly from that of pa...
Abstract-Heat sinks are an extremely useful component that helps to lower maximum temperature of ele...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
Recent development era in technology has huge requirement of high performance lightweight, and compa...
The importance of accounting for the temperature dependence of air properties in numerical simulatio...
The benefits of using strip fin heat sinks (SFHSs) where the cross-sectional aspect ratio of the fin...
The benefits of using notch, slot and multiple circular perforations in plate fin heat sinks (PFHSs)...
The benefits of using pin fin heat sinks with multiple perforations are investigated using complemen...
The benefits of using pin heat sinks (PHSs) with single, rectangular slotted or notched pin perforat...
The official published version of this article can be found at the link below.This paper provides a ...
AbstractMicro heat sinks are adopted in electronics cooling together with different technologies to ...
Experiments were conducted to investigate forced convective cooling performance of an air cooled par...
© Springer Nature Singapore Pte Ltd. 2018. The development of semiconductor fabrication process and ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The development of semiconductor fabrication process and electronic packaging technology causes the ...
The performance of impingement air cooled plate fin heat sinks differs significantly from that of pa...
Abstract-Heat sinks are an extremely useful component that helps to lower maximum temperature of ele...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
Recent development era in technology has huge requirement of high performance lightweight, and compa...
The importance of accounting for the temperature dependence of air properties in numerical simulatio...