The current transport mechanism usually assumed to be valid for metal silicon Schottky barriers is thermionic-emission. However, Crowell and Beguwala, using a thermionic-diffusion model, suggested that significant deviations from the behaviour predicted by the thermionic-emission theory shonld be observed on low barriers, especially those formed on silicon of low impurity concentration. The barrier height of titanium on n-type silicon is 0.1)0 volt which is lower than most other metals, and should make the effects predicted by the thermionic-diffusion theory more important for titanium contacts. Titanium contacts were prepared on n-type silicon with impurity concentratlon from 2 x 10²⁰ m⁻³ to 3 x 10²¹ m⁻³ • Most of the diodes showed nearl...
This thesis is concerned primarily with an experimental and theoretical investigation of the propert...
We present both theoretical and experimental temperature dependences of contact resistivity ρс(Т) fo...
Reactively sputtered titanium-nitride layers have been incorporated as diffusion barriers in a titan...
Metal-silicon Schottky barrier diodes exhibit n values which theoretically vary as a function of dop...
The power MOS transistors were tested with different diffusion barrier type used in metallization co...
The effect of surface treatment on electrical characteristics of aluminum-silicon contacts has been ...
New inspirations respecting the idea to stabilize semiconductor contact metallization by incorporati...
Electrical transport properties of niobium‐silicon contacts are reported over a wide doping range. I...
Three different contact schemes Al–Si, Al/Ti–Si, and Al/TiN/Ti–Si have been studied for their electr...
Investigation and understanding of Schottky diodes continue to be interesting both for basic as well...
The current-voltage characteristics of In/p-Si Schottky diode measured over a temperature range of 1...
Abstract: Metal-insulator-Si (MIS) tunnel contact is studied using ultrathin, non-stoichiometric TiO...
A new mechanism of contact resistance formation in ohmic contacts with high dislocation density is ...
23 pages, 6 figures, added references and minor corrections.We measured the low temperature subgap r...
The evolution of barrier at Schottky contact and its stabilization to value characterized by the bar...
This thesis is concerned primarily with an experimental and theoretical investigation of the propert...
We present both theoretical and experimental temperature dependences of contact resistivity ρс(Т) fo...
Reactively sputtered titanium-nitride layers have been incorporated as diffusion barriers in a titan...
Metal-silicon Schottky barrier diodes exhibit n values which theoretically vary as a function of dop...
The power MOS transistors were tested with different diffusion barrier type used in metallization co...
The effect of surface treatment on electrical characteristics of aluminum-silicon contacts has been ...
New inspirations respecting the idea to stabilize semiconductor contact metallization by incorporati...
Electrical transport properties of niobium‐silicon contacts are reported over a wide doping range. I...
Three different contact schemes Al–Si, Al/Ti–Si, and Al/TiN/Ti–Si have been studied for their electr...
Investigation and understanding of Schottky diodes continue to be interesting both for basic as well...
The current-voltage characteristics of In/p-Si Schottky diode measured over a temperature range of 1...
Abstract: Metal-insulator-Si (MIS) tunnel contact is studied using ultrathin, non-stoichiometric TiO...
A new mechanism of contact resistance formation in ohmic contacts with high dislocation density is ...
23 pages, 6 figures, added references and minor corrections.We measured the low temperature subgap r...
The evolution of barrier at Schottky contact and its stabilization to value characterized by the bar...
This thesis is concerned primarily with an experimental and theoretical investigation of the propert...
We present both theoretical and experimental temperature dependences of contact resistivity ρс(Т) fo...
Reactively sputtered titanium-nitride layers have been incorporated as diffusion barriers in a titan...