The miniaturization and three dimensional die stacking in advanced microelectronic packages poses a big challenge to their non-destructive evaluation by acoustic micro imaging. In particular, their complicated structures and multiple interfaces make the interpretation of acoustic data even more difficult. A common phenomenon observed in acoustic micro imaging of microelectronic packages is the edge effect phenomena, which obscures the detection of defects such as cracks and voids. In this paper, two dimensional finite element modelling is firstly carried out to numerically simulate acoustic micro imaging of modern microelectronic packages. A flip-chip with a 140µm solder bump and a 230MHz virtual transducer with a spot size of 16µm are mode...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
Acoustic Micro Imaging has been used over the past years to successfully evaluate the quality of fli...
Miniaturisation of electronic products is increasingly important for reasons of functionality enhanc...
In acoustic micro imaging of microelectronic packages, edge effect is often presented as artifacts o...
Edge effect is a common phenomenon observed in acoustic micro-imaging of microelectronic packages. I...
Edge effect is a common phenomenon observed in Acoustic micro imaging of microelectronic packages. I...
Complex structures and multiple interfaces of modern microelectronic packages complicate the interpr...
Flip chip technology is being used increasingly as a method of interconnecting a die to a substrate....
A through life non-destructive evaluation technique is presented in which a key solder joint feature...
Solder bump technology is being used increasingly as a method of interconnection of chips or package...
In this paper the performance of multi-narrow-band spectral analysis was evaluated concerning defect...
This paper will review and compare the principles of operation of the scanning acoustic microscope a...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
The increasing application of advanced electronic packages under harsh environmental conditions, ext...
Acoustic Micro Imaging (AMI) has become an established method to evaluate the quality and reliabilit...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
Acoustic Micro Imaging has been used over the past years to successfully evaluate the quality of fli...
Miniaturisation of electronic products is increasingly important for reasons of functionality enhanc...
In acoustic micro imaging of microelectronic packages, edge effect is often presented as artifacts o...
Edge effect is a common phenomenon observed in acoustic micro-imaging of microelectronic packages. I...
Edge effect is a common phenomenon observed in Acoustic micro imaging of microelectronic packages. I...
Complex structures and multiple interfaces of modern microelectronic packages complicate the interpr...
Flip chip technology is being used increasingly as a method of interconnecting a die to a substrate....
A through life non-destructive evaluation technique is presented in which a key solder joint feature...
Solder bump technology is being used increasingly as a method of interconnection of chips or package...
In this paper the performance of multi-narrow-band spectral analysis was evaluated concerning defect...
This paper will review and compare the principles of operation of the scanning acoustic microscope a...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
The increasing application of advanced electronic packages under harsh environmental conditions, ext...
Acoustic Micro Imaging (AMI) has become an established method to evaluate the quality and reliabilit...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
Acoustic Micro Imaging has been used over the past years to successfully evaluate the quality of fli...
Miniaturisation of electronic products is increasingly important for reasons of functionality enhanc...