Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are being introduced, resulting in higher dissipated power densities. Therefore, new and novel technologies are required to remove the heat and to thermally characterise the devices. A particular example of a device that will require these thermal management technologies is the gallium arsenide (GaAs) planar Gunn diode [1] which is being developed for millimetre-wave and terahertz (THz) frequencies, and in which the dissipated power density will be very high (approximately 106 W/cm2 ). This paper will review preliminary thermal and electrical characterisation of a GaAs electro-thermal micro-cooler with the aim of its integration with the ...
The ever-increasing power density of semiconductors used in monolithic microwave integrated circuits...
This paper presents the high temperature thermal characterization of a Micro-Electro-Mechanical Syst...
Miniature aluminium gallium arsenide/gallium arsenide (AlGaAs/GaAs) coolers were fabricated on wafer...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Thermal management of next generation of semiconductor devices is becoming more challenging, as the ...
Modern high frequency electronic devices are continually becoming smaller in area but capable of gen...
The paper describes the use of a novel microparticle sensor (~3 μm diameter) and infra-red (IR) micr...
The thermal management of structures such as Monolithic Microwave Integrated Circuits (MMICs) is imp...
The paper describes design and fabrication of GaAs I()(} mW Gunn diodes for operation at-35 GHz. As ...
The packing density and power capacity of integrated electronics is increasing resulting in higher t...
The paper describes design and fabrication of GaAs 100 mW Gunn diodes for operation at ~35 GHz. As ...
The ever-increasing power density of semiconductors used in monolithic microwave integrated circuits...
Within the european project Microtherm, we have developed a CCD-based thermoreflectance system which...
In this paper, a comprehensive evaluation of thermal behavior of the GaN vertical n+-n−-n-n+ G...
The ever-increasing power density of semiconductors used in monolithic microwave integrated circuits...
This paper presents the high temperature thermal characterization of a Micro-Electro-Mechanical Syst...
Miniature aluminium gallium arsenide/gallium arsenide (AlGaAs/GaAs) coolers were fabricated on wafer...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Electronic devices are shrinking in size and new materials, for example gallium nitride (GaN) are b...
Thermal management of next generation of semiconductor devices is becoming more challenging, as the ...
Modern high frequency electronic devices are continually becoming smaller in area but capable of gen...
The paper describes the use of a novel microparticle sensor (~3 μm diameter) and infra-red (IR) micr...
The thermal management of structures such as Monolithic Microwave Integrated Circuits (MMICs) is imp...
The paper describes design and fabrication of GaAs I()(} mW Gunn diodes for operation at-35 GHz. As ...
The packing density and power capacity of integrated electronics is increasing resulting in higher t...
The paper describes design and fabrication of GaAs 100 mW Gunn diodes for operation at ~35 GHz. As ...
The ever-increasing power density of semiconductors used in monolithic microwave integrated circuits...
Within the european project Microtherm, we have developed a CCD-based thermoreflectance system which...
In this paper, a comprehensive evaluation of thermal behavior of the GaN vertical n+-n−-n-n+ G...
The ever-increasing power density of semiconductors used in monolithic microwave integrated circuits...
This paper presents the high temperature thermal characterization of a Micro-Electro-Mechanical Syst...
Miniature aluminium gallium arsenide/gallium arsenide (AlGaAs/GaAs) coolers were fabricated on wafer...