The ‘‘degree of wetting,’’ which is related to the contact angle (h) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface finish and used atmosphere (inert or non-inert). Furthermore, the surface tension, being an important parameter on the solderability process and performance, can also be achieved if the contact angle is known. In this study, the SAC405 [Sn4.0Ag0.5Cu (in wt.%)] solder paste contact angle was measured, by the ‘‘sessile drop’’ method, as a function of the temperature, surface pad finish and used atmosphere. The results are discussed, and the contact angles obtained for the different c...
Reactive wetting processes of molten Sn-3.5Ag on Cu substrates at elevated temperatures were investi...
Artificially enhancing the solder ability of a surface can at times prove to be advantageous. As chi...
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. How...
The wettability between solder and substrate is a very important issue in reliability of soldering ...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
Abstract: Wettability plays an important role in the integrity of solder joints especially in critic...
The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Solders are fusible metal alloys, used in industry to create permanent bond between metal surfaces. ...
This master´s thesis dealing with study of influence of inert atmosphere on the wettability of solde...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
Lead-free soldering technology is still in its infancy with technical and cost issues posing major c...
Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were ass...
Electronic packaging industries are now in great challenge to find a suitable lead-free solder as an...
Reactive wetting processes of molten Sn-3.5Ag on Cu substrates at elevated temperatures were investi...
Artificially enhancing the solder ability of a surface can at times prove to be advantageous. As chi...
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. How...
The wettability between solder and substrate is a very important issue in reliability of soldering ...
Surface conditions on Printed Circuit Board (PCB) final finishes have an important impact on the wet...
Abstract: Wettability plays an important role in the integrity of solder joints especially in critic...
The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In...
[[abstract]]©2003 MRS - Wetting properties of lead-free solders, Sn-0.7 wt.% Cu and Sn-3.5 wt.% Ag, ...
Solders are fusible metal alloys, used in industry to create permanent bond between metal surfaces. ...
This master´s thesis dealing with study of influence of inert atmosphere on the wettability of solde...
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatu...
Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as ...
Lead-free soldering technology is still in its infancy with technical and cost issues posing major c...
Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates were ass...
Electronic packaging industries are now in great challenge to find a suitable lead-free solder as an...
Reactive wetting processes of molten Sn-3.5Ag on Cu substrates at elevated temperatures were investi...
Artificially enhancing the solder ability of a surface can at times prove to be advantageous. As chi...
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. How...