This paper presents a model, which is capable to simulate the coarsening process observed during thermo-mechanical treatment of binary tin–lead solders. Fourier transforms and spectral theory are used for the numerical treatment of the thermo-elastic as well as of the diffusion problem encountered during phase separation in these alloys. More specifically, the analysis is based exclusively on continuum theory and, first, relies on the numerical computation of the local stresses and strains in a representative volume element. Second, this information is used in an extended diffusion equation to predict the local concentrations of the constituents of the solder. Besides the classical driving forces for phase separation, as introduced by Fick ...
In solder-copper diffusion couples an intermetallic compound layer forms when tin in the solder allo...
This work is concerned with the mathematical analysis of a system of partial differential equations ...
[[abstract]]A solder/intermetallic layers/copper joint assembly was prepared by the dipping process ...
This paper presents a quantitative simulation of the phase separation and coarsening phenomenon in e...
This paper presents a quantitative simulation of the phase separation and coarsening phenomenon in e...
This paper presents a detailed numerical simulation of the coarsening phenomenon observed in microel...
AbstractSolders represent highly versatile and useful materials. They provide a broad range of techn...
Microstructural length scales are relatively large in typical soldered connections. The microstructu...
The reliability of soldered connections is a very important issue in electronics industry. This proj...
Microstructural length scales are relatively largein typical soldered connections. A microstructure ...
This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder a...
In this article, we aim to study the problem of the growth of intermetallic phases in solder joints ...
A combined thermodynamic and diffusion-kinetic approach is very viable for developing microjoining a...
A critical issue in the long-term reliability of solder connections used in electronic packages is t...
In solder-copper diffusion couples an intermetallic compound layer forms when tin in the solder allo...
In solder-copper diffusion couples an intermetallic compound layer forms when tin in the solder allo...
This work is concerned with the mathematical analysis of a system of partial differential equations ...
[[abstract]]A solder/intermetallic layers/copper joint assembly was prepared by the dipping process ...
This paper presents a quantitative simulation of the phase separation and coarsening phenomenon in e...
This paper presents a quantitative simulation of the phase separation and coarsening phenomenon in e...
This paper presents a detailed numerical simulation of the coarsening phenomenon observed in microel...
AbstractSolders represent highly versatile and useful materials. They provide a broad range of techn...
Microstructural length scales are relatively large in typical soldered connections. The microstructu...
The reliability of soldered connections is a very important issue in electronics industry. This proj...
Microstructural length scales are relatively largein typical soldered connections. A microstructure ...
This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder a...
In this article, we aim to study the problem of the growth of intermetallic phases in solder joints ...
A combined thermodynamic and diffusion-kinetic approach is very viable for developing microjoining a...
A critical issue in the long-term reliability of solder connections used in electronic packages is t...
In solder-copper diffusion couples an intermetallic compound layer forms when tin in the solder allo...
In solder-copper diffusion couples an intermetallic compound layer forms when tin in the solder allo...
This work is concerned with the mathematical analysis of a system of partial differential equations ...
[[abstract]]A solder/intermetallic layers/copper joint assembly was prepared by the dipping process ...