A new type of probe card is described which consists of inclined nickel cantilevers formed on top of a three dimensional PDMS layer. A prototype card has been built with an in-line pitch of 23 μm. The presence of a PDMS layer beneath the cantilevers creates mechanically robust probes. The probes can apply up to 100 mN contact force and be deflected up to 40 μm without damage. Typical contact resistances of less than 5 Ω against gold and 15 Ω against copper are reported. The leakage current between adjacent probes is less than 1 nA measured at 100 V
[[abstract]]Probe-after-bump is the primary probing procedure for flip chip technology, since it doe...
Printable electronics is an innovative area of technology with great commercial potential. Here, a s...
This dissertation describes the theoretical design, practical construction and experimental use of a...
A new type of probe card is described which consists of inclined nickel cantilevers formed on top of...
This article introduces a novel type of MEMS probe card that uses polymer (polydimethylsiloxane, PDM...
This thesis is concerned with the design, fabrication and testing of micro scale probes. The probes ...
Abstract—We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-ar...
A new type of MEMS cantilever wafer probe card consists of an array of microcantilevers individually...
Using a copper pillar interconnect in flip chip packaging provides a lead-free solution that is more...
[[abstract]]This work designs an analytic methodology for applying the probe-before-bump procedure t...
This paper documents the development, characterization, and application of a high-resolution thin-fi...
This article describes a software tool for automated probe-mark analysis that minimizes the chance o...
This paper presents the design and testing methodologies for a probe system used in a tip-based thre...
The semiconductor market was valued at over $270 billion in 2007, with projections to continue stead...
Engineers have attempted to improve reliability and lifecycle performance using novel micro-contact ...
[[abstract]]Probe-after-bump is the primary probing procedure for flip chip technology, since it doe...
Printable electronics is an innovative area of technology with great commercial potential. Here, a s...
This dissertation describes the theoretical design, practical construction and experimental use of a...
A new type of probe card is described which consists of inclined nickel cantilevers formed on top of...
This article introduces a novel type of MEMS probe card that uses polymer (polydimethylsiloxane, PDM...
This thesis is concerned with the design, fabrication and testing of micro scale probes. The probes ...
Abstract—We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-ar...
A new type of MEMS cantilever wafer probe card consists of an array of microcantilevers individually...
Using a copper pillar interconnect in flip chip packaging provides a lead-free solution that is more...
[[abstract]]This work designs an analytic methodology for applying the probe-before-bump procedure t...
This paper documents the development, characterization, and application of a high-resolution thin-fi...
This article describes a software tool for automated probe-mark analysis that minimizes the chance o...
This paper presents the design and testing methodologies for a probe system used in a tip-based thre...
The semiconductor market was valued at over $270 billion in 2007, with projections to continue stead...
Engineers have attempted to improve reliability and lifecycle performance using novel micro-contact ...
[[abstract]]Probe-after-bump is the primary probing procedure for flip chip technology, since it doe...
Printable electronics is an innovative area of technology with great commercial potential. Here, a s...
This dissertation describes the theoretical design, practical construction and experimental use of a...