Receiver, transmitter, and ASIC design for optoelectronic-VLSI applications

In modern digital systems, off-chip and intra-chip electrical interconnections suffer from a multitude of limitations as integrated circuits (ICs) continue to grow in size and processing capacity. Optical interconnects are capable of meeting the increasing I/O bandwidth needs in these systems. Optoelectronic-VLSI (OE-VLSI) technology incorporates optical I/O with ICs through the integration of arrays of optoelectronic devices with on-chip receiver and transmitter circuits. These optical I/Os are intended to replace or complement electrical interconnects for off-chip connections, and for connections between processing modules on the same chip or in a multi-chip module.The design of receivers, transmitters, and OE-VLSI application-specific integrated circuits (ASICs) are described from a system implementation perspective. Numerous techniques to overcome technological problems and allow the successful operation of large receiver and transmitter arrays are considered. The use of a fully differential optical and electrical architecture is strongly advocated. The testing of receiver and transmitter circuits and skew in highly parallel and synchronous digital systems employing optical receivers is also considered.The major portion of this thesis details the design, construction, and optical and electrical testing of two OE-VLSI ASICs. The experiences obtained during the design and test of these ASICs, in conjunction with further analytical and simulation-based analyses, resulted in the conclusion that a fully differential optical and electrical architecture is optimal for OE-VLSI applications. The remainder of the thesis considers receiver and transmitter testing and the integration of testing methodologies at the ASIC level, and the management of skew in large receiver arrays