Board-to-board electrical connectivity is a limiting factor for very high bandwidth electronic backplanes. Many physical constraints such as maximum copper trace line density, power consumption of line drivers, transmission line effects and heat dissipation, limit the maximum data throughput achievable for conventional electronic backplanes. On the other hand, photonic backplanes do not have many of the physical limitations that electronic backplanes do. Therefore, by replacing the electronic transceivers in a backplane with optical transmitters and receivers, we can circumvent many of the limitations of conventional electronic backplanes and obtain higher data traffic.This thesis examines the use of vertical-cavity surface-emitting laser (...
With the rapid developments of wireless communication networks such as cellular systems for mobile c...
We report a novel verticalcavity surface-emitting lasers (VCSEL) with monolithically integrated phas...
In this work, a comprehensive dynamic model has been developed for simulating a novel semiconductor ...
We describe a system demonstrator based on vertical-cavity surface-emitting lasers, metal–semiconduc...
Future high performance digital computing systems will demand extremely high throughput and connecti...
AbstractIn recent years the demand for high-performance low-cost optical interconnect components has...
Abstract—We describe the characteristics of a microchannel-based optical backplane including signal-...
Current copper backplane technology has reached the technical limits of clock speed and width for sy...
The ever increasing demand of communication bandwidth places more stringent demands on the electroni...
This thesis examines the design and fabrication of a high output power, surface-emitting laser, know...
The proposal chapter aims at highlighting the tremendous emergence of the Vertical-Cavity Surface-Em...
AbstractWe discuss the advantages of various kinds of light modulators with respect to Vertical Cavi...
The huge progress which has been achieved in the field is covered here, in the first comprehensive m...
Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the teleco...
We contribute with a theoretical analysis, fabrication, and characterization of a novel vertical-cav...
With the rapid developments of wireless communication networks such as cellular systems for mobile c...
We report a novel verticalcavity surface-emitting lasers (VCSEL) with monolithically integrated phas...
In this work, a comprehensive dynamic model has been developed for simulating a novel semiconductor ...
We describe a system demonstrator based on vertical-cavity surface-emitting lasers, metal–semiconduc...
Future high performance digital computing systems will demand extremely high throughput and connecti...
AbstractIn recent years the demand for high-performance low-cost optical interconnect components has...
Abstract—We describe the characteristics of a microchannel-based optical backplane including signal-...
Current copper backplane technology has reached the technical limits of clock speed and width for sy...
The ever increasing demand of communication bandwidth places more stringent demands on the electroni...
This thesis examines the design and fabrication of a high output power, surface-emitting laser, know...
The proposal chapter aims at highlighting the tremendous emergence of the Vertical-Cavity Surface-Em...
AbstractWe discuss the advantages of various kinds of light modulators with respect to Vertical Cavi...
The huge progress which has been achieved in the field is covered here, in the first comprehensive m...
Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the teleco...
We contribute with a theoretical analysis, fabrication, and characterization of a novel vertical-cav...
With the rapid developments of wireless communication networks such as cellular systems for mobile c...
We report a novel verticalcavity surface-emitting lasers (VCSEL) with monolithically integrated phas...
In this work, a comprehensive dynamic model has been developed for simulating a novel semiconductor ...