From curing kinetics to network structure: A novel approach to the modeling of the network buildup of epoxy-anhydride thermosets

The curing kinetics and network buildup during curing of epoxy–anhydride formulations using tertiary amines as initiators are reviewed in this work. A mechanism-based kinetic and structural model has been defined, showing better prediction capabilities than previous living polymerization and simple regeneration models. The curing kinetics have been analyzed using differential scanning calorimetry (DSC), and the gelation during curing has been determined by combined thermomechanical analysis and DSC. The effect of initiator content and epoxy equivalent weight are taken into account. The network buildup has been modeled using a stochastic network buildup model based on the random combination of primary chains generated by the kinetic model.Postprint (published version