Thermal management of nano estructures requires the use of temperature monitoring strategies. In this work we expose a strategy bases on sensing the heat-flux within the chip substrate with a probe-laser beam. As the beam passes through the die, it experiences a deflection directly proportional to the heat-flux found along its trajectory (Internal Interfrared-laser deflection technique, IIR-LD) . As application example, we expose how hot spots can be detected in Integrated Circuits.Postprint (published version
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The propo...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
Thermal management of nano estructures requires the use of temperature monitoring strategies. In thi...
Thermal management of nano estructures requires the use of temperature monitoring strategies. In thi...
This Letter presents a solution for locating hot spots in active integrated circuits (IC) and device...
This Letter presents a solution for locating hot spots in active integrated circuits (IC) and device...
International audienceIn this work we present an original method for detection and localisation of h...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
In this work we present an original method for detection and localisation of heat sources at microsc...
In this work we present an original method for detection and localisation of heat sources at microsc...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The prop...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The propo...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
Thermal management of nano estructures requires the use of temperature monitoring strategies. In thi...
Thermal management of nano estructures requires the use of temperature monitoring strategies. In thi...
This Letter presents a solution for locating hot spots in active integrated circuits (IC) and device...
This Letter presents a solution for locating hot spots in active integrated circuits (IC) and device...
International audienceIn this work we present an original method for detection and localisation of h...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
In this work we present an original method for detection and localisation of heat sources at microsc...
In this work we present an original method for detection and localisation of heat sources at microsc...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The prop...
International audienceSilicon die surface temperature can be used to monitor the health state of dig...
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The propo...
Silicon die surface temperature can be used to monitor the health state of digital and analogue inte...