INCREASE EFFICIENCY IN CUTTING OPERATION OF BLANKS OF SEMICONDUCTOR AND DIELECTRIC MATERIALS INTO PLATES BY DIAMOND SLITTING WHEELS

The work covers the cutting operation of blanks of semiconductor and dielectric materials into the plates. The aim is to increase the efficiency of the blank cutting operation into the plates by means of rational applying lubricant-coolant, stabilization of the cutting edge in slitting wheels and combined machining of the plates.The relations for design of the plate deflection for determination of te height parameters of plates cutted by a stabilized wheel and thickness of the disturbed layer after combined machining have been obtained firstly by an analytical way. The rational conditions of cutting blanks of the non-metallic materials into the plates have been determined; the role of technological inheritance in the defects of cutted plates by the finished bases has been revealed; the new process for stabilization of the slitted wheels has been developed. The technological recommendations and device for tension degree check of AKVR wheels have been introduced in 1993 in the leading enterprise (Production Enterprise "Itil"). The efficiency is expressed in the increase of cutting productivity (1,5-2 times) at keeping yield of the finished plates and in the prevention of rejection caused by AKVR breakdown at their tension. Application field: enterprises of microelectronics and mechanical engineering in operations of cutting blanks of non-metallic materials into plates by diamond slitting wheelsAvailable from VNTIC / VNTIC - Scientific & Technical Information Centre of RussiaSIGLERURussian Federatio