Smart Fabrication Flexible Fab Final report

The manufacturing costs have to be reduced drastically at a simultaneous increase of flexibility, maximum capacity utilization and minimum manufacturing costs to maintain and improve competitiveness of the mciroelectronic component industry - especially in Germany and Europe. Aim of the project has been the cycle time reduction of a single production and the maximum equipment utilization together with a high variety of product technologies and smallest quantity. Other important aims have been the decrease of cycle time, adherence of delivery due date, reduction of wafer manufacturing costs, fast and cost relevant hot-run flow and fast time-to-market for new products and technologies. Based on already existing studies and insights of worldwide development consortia as for example in different JESSI-Eureka- and national FuE-projects (SMART-fabrication CIM, cleanroom- and quality-management), new logistic concepts and methods have been developed for manufacturing optimization in highly flexible semiconductor manufacturing, based on data-, business process-and simulation-models. The project consortium formation made it possible for the semiconductor manufacturer THESYS and SMST to bring their experience concerning the realization of new and the modification of already existing production areas into the project. Newly developed logistic concepts and new data-, business process- and simulation models have been tested within their semiconductor manufacturing to optimize the production and to prove the functionality of the developed system solution. (orig.)SIGLEAvailable from TIB Hannover: F99B1116+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman