Zuverlaessigkeitsuntersuchungen von SMT-Weichloetstellen im visuellen Grenzbereich. Teilvorhaben: Zuverlaessigkeit von Loetstellen bei PLCC 84-Bauelementen Abschlussbericht

The reliability of soldered joints in purposively faulty mounted electronic components has been studied in order to determine the acceptable dislocation tolerance and to diminish efforts for refinishing operations. As the electronic components plastic leaded chip carriers, the PLCC 84 with daisy chain internal wiring were chosen and subjected to temperature change cycles. After different numbers of load cycles the joints were electrically tested and the faailure rate compared with the visually evaluated dislocation. In addition, damages and cracks were characterized by REM and metallographic investigations. It is demonstrated that failures by breakage of the soldered joints can be excluded at x- and y-dislocations up to 50%. (WEN)SIGLEAvailable from TIB Hannover: F97B497+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman