Ball Grid Array Gehaeusetechnologie fuer Multi-Chip-Module. Teilprojekt: MCM-L-Bauform mit BGA Abschlussbericht

Actual status of the technology: Actual status is the assembly of bare dice using chip and wire-technique. In addition there are first applications in flip chip technique for large IC pitches. Target: Within this project the limits for the use of flip chip techniques for consumer and automotive applications had to be checked. Main topics were methods for finer pitches, low costs and high quality. Method: The whole process chain for the production of BGAs in FC-technique including the necessary materials was studied and optimised. For this both test vehicles and functional demonstrators were developed. Results: The necessary processes were successfully developed and tested. Conclusion: Further optimisation of the needed high density PWB-technique and of the system costs are necessary, to be able to construct saleable products. (orig.)SIGLEAvailable from TIB Hannover: F00B400+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman