In situ-Messtechniken fuer Mikrofabrikationstechniken Gemeinsamer Abschlussbericht

By virtue of their non-touch and non-destructive principle it is that optical measuring and testing techniques, especially when employed in the area of MEMS (micro electrical and mechanical systems), are highly suitable for microfabrication. Because of the diversity of the materials used in MEMS and the nature of their surfaces, it is necessary to use different optical measuring techniques. The microcomponents or complete MEMS' are automatically channelled into the measuring module, where they can be tested and examined. The module can be evacuated for the duration of measuring and testing processes. Simultaneously, an electrical wiring-up of the examinees, e.g. for function tests, is possible. The whole process, from the input of the measuring object over the measuring process up to the output, occurs automatically, likewise a corresponding 'superior/inferior' quality decision can be obtained. Besides 3D-measurement techniques, a multispectral ellipsometer for the characterization of optical layers and the gray scale correlation used for the determination of surface shift can be used. The measuring module can be used as an independent solution, or can be bound in existing technological clusters. In the pertinent SMIF (standard mechanical interface) transport boxes, the measuring objects are protected from atmospheric contamination (cleanroom independence). The module was conceptualized especially for the quality supervision in manufacturing MEMS with small to medium numbers of pieces. (orig.)SIGLEAvailable from TIB Hannover: F99B1071 / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman