Anwendung und Entwicklung von grossflaechigen Puffer- und HTSL-Schichten in der HF-Technik. Teilvorhaben: Hoch-T_c-Wafer fuer Hochfrequenz-Anwendungen Abschlussbericht

In collaboration with the Research Center Karlsruhe (FZ Karslruhe) the preparation of large area high-temperature-superconductor (HTSC) films was optimized with respect to their high frequency properties. Employing devices and subsystems designed according to specifications from satellite communication, the principle advantages in performance using HTSC technology was demonstrated. Problems and difficulties for a future product development were also shown. The main problems in high frequency applications are packaging, realization of high quality contacts to the HTSC-films and tolerances in the fabrication process. For all problems possible solutions have been developed and verified. (orig.)Available from TIB Hannover: F96B1777+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman