Technologien und Werkzeuge zum Entwurf und zur Realisierung anwendungsspezifischer Mikrosensoren fuer mechanische Groessen 1990 - 1993 Abschlussbericht

The report is divided into three topics. The first part describes the development of a simulation tool for mechanical sensor design using the piezoressistive and the capacitive principle. Based on the program TPS 10 a new modular simulation packet is presented. The second topic is devoted to the development of silicon sensors for mechanical quantities (pressure, acceleration) with monolithic integrated circuits. In the frame of a third partial project a novel stress free assembly technique for silicon based on micromechanical devices has been developed. (WEN)Available from TIB Hannover: RO 3532(8) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Forschung und Technologie (BMFT), Bonn (Germany)DEGerman