Add to ORKGSIGLEAvailable from British Library Document Supply Centre- DSC:9091.9(AEA-InTec--0976) / BLDSC - British Library Document Supply CentreGBUnited Kingdo
SIGLEAvailable from British Library Document Supply Centre- DSC:3661.0182(EU-PICT-WP--46) / BLDSC - ...
In this paper, we focussed about the failures in copper interconnects and on analytical techniques t...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN056034 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre-DSC:DXN036990 / BLDSC - British Library D...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN063906 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN065248 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre- DSC:3597.9341(278) / BLDSC - British Lib...
IC architecture makes extensively use of multiple interconnect levels with many vias that enable ele...
We have developed a novel physical model and a simulation algorithm capable of predicting electromig...
ISBN 978-1-4577-1678-2International audiencehis paper focuses on electromigration of SnAgCu intercon...
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the ...
The scaling down of technologies presents new challenges in reliability, one of them being electromi...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
SIGLEAvailable from British Library Document Supply Centre-DSC:3597.937(9625) / BLDSC - British Libr...
SIGLEAvailable from British Library Document Supply Centre- DSC:3661.0182(EU-PICT-WP--46) / BLDSC - ...
In this paper, we focussed about the failures in copper interconnects and on analytical techniques t...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN056034 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre-DSC:DXN036990 / BLDSC - British Library D...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN063906 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre- DSC:DXN065248 / BLDSC - British Library ...
SIGLEAvailable from British Library Document Supply Centre- DSC:3597.9341(278) / BLDSC - British Lib...
IC architecture makes extensively use of multiple interconnect levels with many vias that enable ele...
We have developed a novel physical model and a simulation algorithm capable of predicting electromig...
ISBN 978-1-4577-1678-2International audiencehis paper focuses on electromigration of SnAgCu intercon...
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the ...
The scaling down of technologies presents new challenges in reliability, one of them being electromi...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
SIGLEAvailable from British Library Document Supply Centre-DSC:3597.937(9625) / BLDSC - British Libr...
SIGLEAvailable from British Library Document Supply Centre- DSC:3661.0182(EU-PICT-WP--46) / BLDSC - ...
In this paper, we focussed about the failures in copper interconnects and on analytical techniques t...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...