Rheology testing of solder pastes and conductive adhesives used in stencil printing

The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance

Zou, L.
Dusek, M.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(18) / BLDSC - British Libra...

Development and evaluation of a non-destructive adhesion test

Hussain, M.S

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:DX94879 / BLDSC - British Library Do...

Processing and rheological studies of cellulosic materials

Tsang, S.C.N
Sheffield City Polytechnic (United Kingdom)
Council for National Academic Awards (CNAA), London (United Kingdom)

January 1987

SIGLEAvailable from British Library Document Supply Centre- DSC:D73246/87 / BLDSC - British Library ...

Rheology testing of solder pastes and conductive adhesives A guide

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(109) / BLDSC - British Libr...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology

Durairaj, Rajkumar

January 2006

The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R.
Ramesh, S.
Mallik, S.
Seman, A.
Ekere, N.

October 2009

Lead-free solder paste printing process accounts for majority of the assembly defects in the electro...

Characterising stencil printing of surface mount and conductive adhesives

Dusek, M.
Zou, L.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2002

Available from British Library Document Supply Centre-DSC:6180.5139(55) / BLDSC - British Library Do...

A novel measurement technique for stencil printed solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(08) / BLDSC - British Libra...

Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes

Durairaj, Rajkumar
Man, Lam Wai
Mallik, Sabuj
Ekere, Ndy

The stencil printing process is an important process in the assembly of Surface Mount Technology (SM...

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Mallik, S.
Schmidt, M.
Bauer, R.
Ekere, N.N.

January 2010

Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...

Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

Amalu, Emeka H.
Ekere, Ndy
Mallik, Sabuj

February 2011

Although stencil printing is widely used in surface mount technology, it is believed to be the main ...

Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance

Mallik, Sabuj
Thieme, Jens
Bauer, R.
Ekere, Ndy
Seman, Anton
Bhatti, Rajinderpal
Durairaj, Rajkumar

February 2010

Solder paste plays an important role in the electronic assembly process by providing electrical, mec...

Influence of solder paste components on rheological behaviour

Mallik, Sabuj
Schmidt, M.
Bauer, R.
Ekere, Ndy

September 2008

Rheological properties of solder pastes are very important for a high quality surface mount technolo...

Solder paste characterisation: towards the development of quality control (QC) tool

Durairaj, Rajkumar
Mallik, Sabuj
Ekere, Ndy

January 2008

Purpose – The purpose of this paper is to develop a quality control tool based on rheological test m...

The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance

Zou, L.
Dusek, M.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(18) / BLDSC - British Libra...

Development and evaluation of a non-destructive adhesion test

Hussain, M.S

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:DX94879 / BLDSC - British Library Do...

Processing and rheological studies of cellulosic materials

Tsang, S.C.N
Sheffield City Polytechnic (United Kingdom)
Council for National Academic Awards (CNAA), London (United Kingdom)

January 1987

SIGLEAvailable from British Library Document Supply Centre- DSC:D73246/87 / BLDSC - British Library ...

Rheology testing of solder pastes and conductive adhesives A guide

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(109) / BLDSC - British Libr...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology

Durairaj, Rajkumar

January 2006

The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R.
Ramesh, S.
Mallik, S.
Seman, A.
Ekere, N.

October 2009

Lead-free solder paste printing process accounts for majority of the assembly defects in the electro...

Characterising stencil printing of surface mount and conductive adhesives

Dusek, M.
Zou, L.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2002

Available from British Library Document Supply Centre-DSC:6180.5139(55) / BLDSC - British Library Do...

A novel measurement technique for stencil printed solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(08) / BLDSC - British Libra...

Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes

Durairaj, Rajkumar
Man, Lam Wai
Mallik, Sabuj
Ekere, Ndy

The stencil printing process is an important process in the assembly of Surface Mount Technology (SM...

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Mallik, S.
Schmidt, M.
Bauer, R.
Ekere, N.N.

January 2010

Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...

Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

Amalu, Emeka H.
Ekere, Ndy
Mallik, Sabuj

February 2011

Although stencil printing is widely used in surface mount technology, it is believed to be the main ...

Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance

Mallik, Sabuj
Thieme, Jens
Bauer, R.
Ekere, Ndy
Seman, Anton
Bhatti, Rajinderpal
Durairaj, Rajkumar

February 2010

Solder paste plays an important role in the electronic assembly process by providing electrical, mec...

Influence of solder paste components on rheological behaviour

Mallik, Sabuj
Schmidt, M.
Bauer, R.
Ekere, Ndy

September 2008

Rheological properties of solder pastes are very important for a high quality surface mount technolo...

Solder paste characterisation: towards the development of quality control (QC) tool

Durairaj, Rajkumar
Mallik, Sabuj
Ekere, Ndy

January 2008

Purpose – The purpose of this paper is to develop a quality control tool based on rheological test m...

The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance

Zou, L.
Dusek, M.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(18) / BLDSC - British Libra...

Development and evaluation of a non-destructive adhesion test

Hussain, M.S

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:DX94879 / BLDSC - British Library Do...

Processing and rheological studies of cellulosic materials

Tsang, S.C.N
Sheffield City Polytechnic (United Kingdom)
Council for National Academic Awards (CNAA), London (United Kingdom)

January 1987

SIGLEAvailable from British Library Document Supply Centre- DSC:D73246/87 / BLDSC - British Library ...

Rheology testing of solder pastes and conductive adhesives used in stencil printing

Abstract

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Rheology testing of solder pastes and conductive adhesives used in stencil printing

Abstract

Extracted data

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