Rheology testing of solder pastes and conductive adhesives A guide

Test methods for determining hyperelastic properties of flexible adhesives

Duncan, B.
National Physical Lab., Teddington (United Kingdom). Centre for Materials Measurement and Technology

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:5413.5656(54) / BLDSC - British Libra...

Development of new solderability test fluxes

Brewin, Alan
Zou, Ling
Hunt, Christopher
National Physical Laboratory (Great Britain) (United Kingdom)

January 2002

Includes bibliographical referencesAvailable from British Library Document Supply Centre- DSC:6180. ...

An investigation into the rheological properties of different lead-free solder pastes for surface mount applications

Mallik, Sabuj
Ekere, Ndy
Durairaj, Rajkumar
Marks, Antony

January 2008

Purpose – The purpose of this paper is to investigate the rheological behaviour of three different l...

Rheology testing of solder pastes and conductive adhesives used in stencil printing

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(102) / BLDSC - British Libr...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Durairaj, R.
Mallik, S.
Seman, A.
Marks, A.
Ekere, N.N.

April 2009

Solder pastes and isotropic conductive adhesives (ICAs) are widely used as a principal bonding mediu...

The rheology and strength of hot melt adhesives

Doody, P.D.

January 1997

SIGLEAvailable from British Library Document Supply Centre-DSC:DXN009844 / BLDSC - British Library D...

Conductive adhesives versus lead based solders A comparison of performance

Dusek, M.
Jonck, R.
Subotic, B. (and others)
National Physical Lab., Teddington (United Kingdom). Centre for Materials Measurement and Technology

January 2000

SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(297) / BLDSC - British Lib...

Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology

Durairaj, Rajkumar

January 2006

The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...

A clinical and laboratory investigation of adhesive restorative materials

Walls, A.W.G

January 1985

SIGLEAvailable from British Library Document Supply Centre- DSC:D67510/86 / BLDSC - British Library ...

Processing and rheological studies of cellulosic materials

Tsang, S.C.N
Sheffield City Polytechnic (United Kingdom)
Council for National Academic Awards (CNAA), London (United Kingdom)

January 1987

SIGLEAvailable from British Library Document Supply Centre- DSC:D73246/87 / BLDSC - British Library ...

Development and evaluation of a non-destructive adhesion test

Hussain, M.S

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:DX94879 / BLDSC - British Library Do...

Materials testing for constitutive relations

Macdougall, D.

January 1997

SIGLEAvailable from British Library Document Supply Centre-DSC:D195462 / BLDSC - British Library Doc...

Tensile testing of adhesive butt-joint specimens

Crocker, L.
Dean, G.
National Physical Lab., Teddington (United Kingdom). Materials Centre

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:5413.5658(09) / BLDSC - British Libra...

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Mallik, S.
Schmidt, M.
Bauer, R.
Ekere, N.N.

January 2010

Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...

Test methods for determining hyperelastic properties of flexible adhesives

Duncan, B.
National Physical Lab., Teddington (United Kingdom). Centre for Materials Measurement and Technology

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:5413.5656(54) / BLDSC - British Libra...

Development of new solderability test fluxes

Brewin, Alan
Zou, Ling
Hunt, Christopher
National Physical Laboratory (Great Britain) (United Kingdom)

January 2002

Includes bibliographical referencesAvailable from British Library Document Supply Centre- DSC:6180. ...

An investigation into the rheological properties of different lead-free solder pastes for surface mount applications

Mallik, Sabuj
Ekere, Ndy
Durairaj, Rajkumar
Marks, Antony

January 2008

Purpose – The purpose of this paper is to investigate the rheological behaviour of three different l...

Rheology testing of solder pastes and conductive adhesives used in stencil printing

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(102) / BLDSC - British Libr...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Durairaj, R.
Mallik, S.
Seman, A.
Marks, A.
Ekere, N.N.

April 2009

Solder pastes and isotropic conductive adhesives (ICAs) are widely used as a principal bonding mediu...

The rheology and strength of hot melt adhesives

Doody, P.D.

January 1997

SIGLEAvailable from British Library Document Supply Centre-DSC:DXN009844 / BLDSC - British Library D...

Conductive adhesives versus lead based solders A comparison of performance

Dusek, M.
Jonck, R.
Subotic, B. (and others)
National Physical Lab., Teddington (United Kingdom). Centre for Materials Measurement and Technology

January 2000

SIGLEAvailable from British Library Document Supply Centre-DSC:6029.28073(297) / BLDSC - British Lib...

Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology

Durairaj, Rajkumar

January 2006

The printing of solder pastes through very small stencil apertures required for flip-chip pitch size...

A clinical and laboratory investigation of adhesive restorative materials

Walls, A.W.G

January 1985

SIGLEAvailable from British Library Document Supply Centre- DSC:D67510/86 / BLDSC - British Library ...

Processing and rheological studies of cellulosic materials

Tsang, S.C.N
Sheffield City Polytechnic (United Kingdom)
Council for National Academic Awards (CNAA), London (United Kingdom)

January 1987

SIGLEAvailable from British Library Document Supply Centre- DSC:D73246/87 / BLDSC - British Library ...

Development and evaluation of a non-destructive adhesion test

Hussain, M.S

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:DX94879 / BLDSC - British Library Do...

Materials testing for constitutive relations

Macdougall, D.

January 1997

SIGLEAvailable from British Library Document Supply Centre-DSC:D195462 / BLDSC - British Library Doc...

Tensile testing of adhesive butt-joint specimens

Crocker, L.
Dean, G.
National Physical Lab., Teddington (United Kingdom). Materials Centre

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:5413.5658(09) / BLDSC - British Libra...

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Mallik, S.
Schmidt, M.
Bauer, R.
Ekere, N.N.

January 2010

Purpose: To study the rheological behaviours of lead free solder pastes used for flip-chip assembly ...

Test methods for determining hyperelastic properties of flexible adhesives

Duncan, B.
National Physical Lab., Teddington (United Kingdom). Centre for Materials Measurement and Technology

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:5413.5656(54) / BLDSC - British Libra...

Development of new solderability test fluxes

Brewin, Alan
Zou, Ling
Hunt, Christopher
National Physical Laboratory (Great Britain) (United Kingdom)

January 2002

Includes bibliographical referencesAvailable from British Library Document Supply Centre- DSC:6180. ...

An investigation into the rheological properties of different lead-free solder pastes for surface mount applications

Mallik, Sabuj
Ekere, Ndy
Durairaj, Rajkumar
Marks, Antony

January 2008

Purpose – The purpose of this paper is to investigate the rheological behaviour of three different l...

Rheology testing of solder pastes and conductive adhesives A guide

Abstract

Extracted data

Rheology testing of solder pastes and conductive adhesives A guide

Abstract

Extracted data

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