Characterisation of solder pastes used in the reflow soldering of surface mount assembly

Characterising stencil printing of surface mount and conductive adhesives

Dusek, M.
Zou, L.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2002

Available from British Library Document Supply Centre-DSC:6180.5139(55) / BLDSC - British Library Do...

Technological developments for high quality soldering and brazing

British Association for Brazing and Soldering (BABS), London (United Kingdom)

January 1985

SIGLEAvailable from British Library Document Supply Centre- DSC:87/09248(Technological) / BLDSC - Br...

Measurement of solder fume

Pengelly, I.
Health and Safety Lab., Sheffield (United Kingdom)

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:4274.8537(99/04) / BLDSC - British Li...

Creep properties of SnAgCu solder in surface mount assemblies

Nottay, J.
Dusek, M.
Hunt, C. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(51) / BLDSC - British Libra...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

The Analysis of Solder Preforms in Surface Mount Assembly

Novotný, Václav
Vala, Radek

January 2016

This article is focused on the sphere of solder joints reliability in technology of surface mount as...

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Amalu, E.H.
Lau, W.K.
Ekere, N.N.
Bhatti, R.S.
Mallik, S.
Otiaba, K.C.
Takyi, G.

July 2011

The reliability of solder joints in electronic products are greatly enhanced by good stencil printin...

A novel measurement technique for stencil printed solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(08) / BLDSC - British Libra...

Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

Amalu, Emeka H.
Lui, Y.T.
Ekere, Ndy
Bhatti, R.S.
Takyi, G.

January 2011

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT)...

Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process

Horsley, Robert Michael

January 2002

Available from British Library Document Supply Centre- DSC:DXN064445 / BLDSC - British Library Docum...

Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique

Lim, Kean Teik

January 2016

Surface mount technology (SMT) is a method for producing electronic circuits in which the components...

Bismuth Low Temperature Solder Pastes

Švéda, Miloš

January 2019

This master´s thesis deals with bismuth low temperature solder pastes. Describes the properties of b...

Rheology testing of solder pastes and conductive adhesives A guide

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(109) / BLDSC - British Libr...

Solder Paste Comparison from Solder Joint Reliability Point of View

Dokoupil, Jakub

January 2018

This thesis deals with the teoretical description of the solder during reflow soldering the solder p...

Surface characterisation of semiconductor materials

Hart, L

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:D94888 / BLDSC - British Library Doc...

Characterising stencil printing of surface mount and conductive adhesives

Dusek, M.
Zou, L.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2002

Available from British Library Document Supply Centre-DSC:6180.5139(55) / BLDSC - British Library Do...

Technological developments for high quality soldering and brazing

British Association for Brazing and Soldering (BABS), London (United Kingdom)

January 1985

SIGLEAvailable from British Library Document Supply Centre- DSC:87/09248(Technological) / BLDSC - Br...

Measurement of solder fume

Pengelly, I.
Health and Safety Lab., Sheffield (United Kingdom)

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:4274.8537(99/04) / BLDSC - British Li...

Creep properties of SnAgCu solder in surface mount assemblies

Nottay, J.
Dusek, M.
Hunt, C. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(51) / BLDSC - British Libra...

Assessment of rheological properties of materials used in printing of solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(76) / BLDSC - British Libra...

The Analysis of Solder Preforms in Surface Mount Assembly

Novotný, Václav
Vala, Radek

January 2016

This article is focused on the sphere of solder joints reliability in technology of surface mount as...

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Amalu, E.H.
Lau, W.K.
Ekere, N.N.
Bhatti, R.S.
Mallik, S.
Otiaba, K.C.
Takyi, G.

July 2011

The reliability of solder joints in electronic products are greatly enhanced by good stencil printin...

A novel measurement technique for stencil printed solder paste

Dusek, M.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2001

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(08) / BLDSC - British Libra...

Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

Amalu, Emeka H.
Lui, Y.T.
Ekere, Ndy
Bhatti, R.S.
Takyi, G.

January 2011

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT)...

Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process

Horsley, Robert Michael

January 2002

Available from British Library Document Supply Centre- DSC:DXN064445 / BLDSC - British Library Docum...

Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique

Lim, Kean Teik

January 2016

Surface mount technology (SMT) is a method for producing electronic circuits in which the components...

Bismuth Low Temperature Solder Pastes

Švéda, Miloš

January 2019

This master´s thesis deals with bismuth low temperature solder pastes. Describes the properties of b...

Rheology testing of solder pastes and conductive adhesives A guide

Dusek, M.
Zou, L.
Hunt, C.
National Physical Lab., Teddington (United Kingdom)

January 2002

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(109) / BLDSC - British Libr...

Solder Paste Comparison from Solder Joint Reliability Point of View

Dokoupil, Jakub

January 2018

This thesis deals with the teoretical description of the solder during reflow soldering the solder p...

Surface characterisation of semiconductor materials

Hart, L

January 1990

SIGLEAvailable from British Library Document Supply Centre- DSC:D94888 / BLDSC - British Library Doc...

Characterising stencil printing of surface mount and conductive adhesives

Dusek, M.
Zou, L.
Wickham, M. (and others)
National Physical Lab., Teddington (United Kingdom)

January 2002

Available from British Library Document Supply Centre-DSC:6180.5139(55) / BLDSC - British Library Do...

Technological developments for high quality soldering and brazing

British Association for Brazing and Soldering (BABS), London (United Kingdom)

January 1985

SIGLEAvailable from British Library Document Supply Centre- DSC:87/09248(Technological) / BLDSC - Br...

Measurement of solder fume

Pengelly, I.
Health and Safety Lab., Sheffield (United Kingdom)

January 1999

SIGLEAvailable from British Library Document Supply Centre-DSC:4274.8537(99/04) / BLDSC - British Li...

Characterisation of solder pastes used in the reflow soldering of surface mount assembly

Abstract

Extracted data

Characterisation of solder pastes used in the reflow soldering of surface mount assembly

Abstract

Extracted data

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