Mechanical Testing of Joints Glued/Soldered on Textile Ribbons

the Ministry of Education, Youth and Sports of the Czech Republic under the project OP VVV Electrical Engineering Technologies with High-Level of Embedded Intelligence CZ.02.1.01/0.0/0.0/18_069/0009855 and by the Student Grant Agency of the University of West Bohemia in Pilsen, grant No. SGS-2018-016 “Technology and Materials Systems in Electrical Engineering”This paper deals with the assembly of SMD chip resistors onto a conductive textile ribbon by soldering or gluing. The main goal of our research was to verify the reliability of joints after jerk testing of ribbons. The results showed that soldered / glued joints on electrically conductive textile ribbon are reliable during jerking test until the destruction of whole ribbon and electrical resistance of joints is low and stable until this destruction during extreme jerking