Recently, to the extent allowed by the fabricating technology, approaches have been made to develop an automated router for the multi-layer IC layout design. In this thesis, we examine the VLSI routing problem where three layers are available for interconnection;We investigate the routing problem in three stages: global routing, power/ground routing, and channel routing. The global routing for three-interconnection layer model is not much different from that of two-layer madel. We study the global routing problem for two cases: gate array and general cell layout. In our three-layer grid model, power/ground wires keep the direction-per-layer scheme as signal net wires. However, the power/ground routing is further constrained by the width of ...