The defect structure of gallium arsenide is being examined using white beam transmission topography. The specimens under examination are cut-and-polished, three inch diameter, single crystal substrates from various suppliers in the “as received” condition. The goal of this continuing program is to first document the existence of various crystallographic defect structures and then to establish their effect on the performance of microwave integrated circuits subsequently fabricated on the wafers. Success in establishing such a correlation might permit the use of an x-ray diffraction measurement to screen incoming material, eliminating marginal substrates and achieving a corresponding increase in yield
Threading dislocations in gallium arsenide and point defects in silicon were observed for the first ...
In this thesis, dislocations and other crystal defects of compound semiconductor materials were char...
A method for the structure analysis of point defects in a semiconductor layer is developed by combin...
A series of samples cut out from different types of gallium arsenide crystals with low dislocation d...
Novel, streak-like disruption features restricted to the plane of diffraction have recently been obs...
X-ray topography is a nondestructive technique to characterize strain and visualize inhomogeneties, ...
The defect structure of HVPE-GaN crystals are examined using synchrotron white-beam X-ray topography...
This thesis describes the application of the well established technique of X-ray diffraction topogra...
Germanium and GaAs crystals were investigated for studies on photovoltaic effects, chemical etching ...
A ductile damage progress of FCC single crystal was verified by a profile analysis using white X-ray...
The objective of this research program is to develop methods of structural analysis based on high re...
The crystal quality of bulk GaN crystals is continuously improving due to advances in GaN growth tec...
A synchrotron x-ray topography analysis of the impact of the distribution of defects/dislocations on...
Streaking images restricted to the direction of the diffraction (scattering) vector have been observ...
The White Beam Synchrotron X-Ray Topography (WBSXRT) technique was used to assess sapphire wafer qua...
Threading dislocations in gallium arsenide and point defects in silicon were observed for the first ...
In this thesis, dislocations and other crystal defects of compound semiconductor materials were char...
A method for the structure analysis of point defects in a semiconductor layer is developed by combin...
A series of samples cut out from different types of gallium arsenide crystals with low dislocation d...
Novel, streak-like disruption features restricted to the plane of diffraction have recently been obs...
X-ray topography is a nondestructive technique to characterize strain and visualize inhomogeneties, ...
The defect structure of HVPE-GaN crystals are examined using synchrotron white-beam X-ray topography...
This thesis describes the application of the well established technique of X-ray diffraction topogra...
Germanium and GaAs crystals were investigated for studies on photovoltaic effects, chemical etching ...
A ductile damage progress of FCC single crystal was verified by a profile analysis using white X-ray...
The objective of this research program is to develop methods of structural analysis based on high re...
The crystal quality of bulk GaN crystals is continuously improving due to advances in GaN growth tec...
A synchrotron x-ray topography analysis of the impact of the distribution of defects/dislocations on...
Streaking images restricted to the direction of the diffraction (scattering) vector have been observ...
The White Beam Synchrotron X-Ray Topography (WBSXRT) technique was used to assess sapphire wafer qua...
Threading dislocations in gallium arsenide and point defects in silicon were observed for the first ...
In this thesis, dislocations and other crystal defects of compound semiconductor materials were char...
A method for the structure analysis of point defects in a semiconductor layer is developed by combin...