A self-similar reaction front develops in reactive ion etching when the ions penetrate channels of shallow height h. This relates to the patterning of microchannels using a single-step etching and bonding, as described by Rhee et al. [Lab Chip 5, 102 (2005)]. Experimentally, we report that the front location scales as x(f) similar to ht(1/2) and the width is time-invariant and scales as delta similar to h. Mean-field reaction-diffusion theory and Knudsen diffusion give a semiquantitative understanding of these observations and allow optimization of etching times in relation to bonding requirements. (C) 2011 American Institute of Physics. [doi:10.1063/1.3578450]FWN – Publicaties zonder aanstelling Universiteit Leide
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
Ta_(36)Si_(14)N_(50) amorphous layers were reactive ion etched in CF_(4)+O_(2) plasmas. The etch dep...
Photolithographic patterning of photoresist materials and transfer of these images into electronic m...
A self-similar reaction front develops in reactive ion etching when the ions penetrate channels of s...
190 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The nature of transport and r...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 1995.Includes...
A video system has been designed to monitor in situ and accurately the etching of sacrificial phosph...
L'interaction plasma-polymère constitue aujourd'hui une discipline à part entière en raison des très...
The evolution of surfaces during plasma etching was investigated, using a combination of theoretical...
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, ...
Plasma etching is an essential process in the fabrication of subm cron features in the semiconductor...
L'objectif de ce travail porte sur la généralisation de la modélisation de la gravure du silicium da...
Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, ...
A combined experimental nd modeling study of uniformity in CF4/O2 plasma etching of silicon is prese...
This paper reports a mass transfer model of a reactant flowing in a large aspect ratio microfluidic ...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
Ta_(36)Si_(14)N_(50) amorphous layers were reactive ion etched in CF_(4)+O_(2) plasmas. The etch dep...
Photolithographic patterning of photoresist materials and transfer of these images into electronic m...
A self-similar reaction front develops in reactive ion etching when the ions penetrate channels of s...
190 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1988.The nature of transport and r...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 1995.Includes...
A video system has been designed to monitor in situ and accurately the etching of sacrificial phosph...
L'interaction plasma-polymère constitue aujourd'hui une discipline à part entière en raison des très...
The evolution of surfaces during plasma etching was investigated, using a combination of theoretical...
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, ...
Plasma etching is an essential process in the fabrication of subm cron features in the semiconductor...
L'objectif de ce travail porte sur la généralisation de la modélisation de la gravure du silicium da...
Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, ...
A combined experimental nd modeling study of uniformity in CF4/O2 plasma etching of silicon is prese...
This paper reports a mass transfer model of a reactant flowing in a large aspect ratio microfluidic ...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
Ta_(36)Si_(14)N_(50) amorphous layers were reactive ion etched in CF_(4)+O_(2) plasmas. The etch dep...
Photolithographic patterning of photoresist materials and transfer of these images into electronic m...