Electrodeposition Behavior of Fe-W Alloy Plaing and Metallic Tungsten Deposition on Iron-Group Metal Cathode

石田, 幸平
中出, 卓男
森河, 務
三宅, 正男
平藤, 哲司

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Publication date

November 2018

DOI

10.4139/sfj.69.533

Publisher

The Surface Finishing Society of Japan

Journal

Journal of The Surface Finishing Society of Japan

Abstract

We investigated the metal ion concentration effects on film composition of Fe-W alloy plating and tungsten deposition on the iron group metal cathode. Tungsten was deposited at a limited atomic ratio to iron group metals. Tungstate ions can be reduced to a metallic state on the iron group metal cathode by complexing with citrate ions

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Electrodeposition Behavior of Fe-W Alloy Plaing and Metallic Tungsten Deposition on Iron-Group Metal Cathode

Abstract

Extracted data

Electrodeposition Behavior of Fe-W Alloy Plaing and Metallic Tungsten Deposition on Iron-Group Metal Cathode

Abstract

Extracted data

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