As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in front of the evolution of supercomputers towards the exaflops era. Energy and temperature walls are big challenges to face for assuring a constant grow of performance in future. New generation architectures for HPC systems implement HW and SW components to address energy and thermal issues for increasing power and efficient computing in scientific workload. In thermal-bound HPC machines, workload-aware runtimes can leverage hardware knobs to guarantee the best operating point in term of performance and power saving without violating thermal constraints. In this paper, we present an integer-linear programming formulation for job mapping and freque...
In High Performance Computing, being respectful of the environment is usually secondary compared to ...
Power consumption and process variability are two important, interconnected, challenges of future ge...
Energy-efficiency is of primary interest in future HPC systems as their computational growth is limi...
As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in fron...
We are entering the era of thermally-bound computing: Advanced and costly cooling solutions are need...
In the scope of technical and scientific computing the rush towards larger simulations, has been so ...
International audienceModern high performance computing subsystems (HPC) - including processor, netw...
With the advent of a new generation of supercomputers characterized by tightly-coupled integration o...
International audienceDespite recent advances in improving the performance of high performance compu...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Datacenters have become an important part of today's computing infrastructure. Recent studies have s...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Thermal control is a key aspect of large-scale HPC centers, where a large number of computing elemen...
In High Performance Computing, being respectful of the environment is usually secondary compared to ...
Power consumption and process variability are two important, interconnected, challenges of future ge...
Energy-efficiency is of primary interest in future HPC systems as their computational growth is limi...
As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in fron...
We are entering the era of thermally-bound computing: Advanced and costly cooling solutions are need...
In the scope of technical and scientific computing the rush towards larger simulations, has been so ...
International audienceModern high performance computing subsystems (HPC) - including processor, netw...
With the advent of a new generation of supercomputers characterized by tightly-coupled integration o...
International audienceDespite recent advances in improving the performance of high performance compu...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
Datacenters have become an important part of today's computing infrastructure. Recent studies have s...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Thermal control is a key aspect of large-scale HPC centers, where a large number of computing elemen...
In High Performance Computing, being respectful of the environment is usually secondary compared to ...
Power consumption and process variability are two important, interconnected, challenges of future ge...
Energy-efficiency is of primary interest in future HPC systems as their computational growth is limi...