Recently, industrial product parts and components are being made smaller to reduce energy consumption and save space, creating a growing need for the micro-welding of thin foil less than 100μm thick. For this purpose, laser processing is expected to be the method of choice because it allows more precise heat control compared with arc and plasma processing. In this report, the practicability of welding thin stainless steel foil with a direct diode laser system was investigated. The elliptically shaped laser beam of the direct diode laser enabled successful butt-welding of thin stainless steel foil 100μm and less in thickness. At a output power of 100W, 100μm and 50μm thick foils could be welded at a high speed of 6.0m/min and 18.0m/min, resp...
Abstract: Only a few welding processes for plastics meet the special demands of microtech-nology. La...
In the presented study, the laser welding of wire to flat geometry for miniature electromechanical h...
The joining processes in electronic device manufacturing are today still dominated by conventional j...
AbstractIn this study the process of laser-based micro welding was examined using the example of ult...
AbstractMetal foils are commonly used for catalytic converters, vacuum insulations, in medical and e...
AbstractIn this paper, the influence of focal diameter, feeding rate and thermo-mechanical character...
This paper investigated various aspects of replacing existing micro-resistance spot welding (micro-R...
Experiments were conducted to study the weldability of a 50 ??m-thick AM350 stainless steel foil ont...
Recently, since the size of component becomes smaller, then the welding of thin metal sheet has been...
The combination of dissimilar materials like brass and stainless steel is often needed in watch move...
The combination of dissimilar materials like brass and stainless steel is often needed in watch move...
none5This paper presents the recent results in micro-welding of nearly eutectoid steels obtained wit...
AbstractIn this study a pulsed Nd:YAG laser was used to join Monel 400 thin foil with μm thickness. ...
none4noThe present paper assesses the applicability of laser powder direct energy deposition for wel...
In this study a pulsed Nd:YAG laser was used to join Monel 400 thin foil with 100 mu m thickness. Pu...
Abstract: Only a few welding processes for plastics meet the special demands of microtech-nology. La...
In the presented study, the laser welding of wire to flat geometry for miniature electromechanical h...
The joining processes in electronic device manufacturing are today still dominated by conventional j...
AbstractIn this study the process of laser-based micro welding was examined using the example of ult...
AbstractMetal foils are commonly used for catalytic converters, vacuum insulations, in medical and e...
AbstractIn this paper, the influence of focal diameter, feeding rate and thermo-mechanical character...
This paper investigated various aspects of replacing existing micro-resistance spot welding (micro-R...
Experiments were conducted to study the weldability of a 50 ??m-thick AM350 stainless steel foil ont...
Recently, since the size of component becomes smaller, then the welding of thin metal sheet has been...
The combination of dissimilar materials like brass and stainless steel is often needed in watch move...
The combination of dissimilar materials like brass and stainless steel is often needed in watch move...
none5This paper presents the recent results in micro-welding of nearly eutectoid steels obtained wit...
AbstractIn this study a pulsed Nd:YAG laser was used to join Monel 400 thin foil with μm thickness. ...
none4noThe present paper assesses the applicability of laser powder direct energy deposition for wel...
In this study a pulsed Nd:YAG laser was used to join Monel 400 thin foil with 100 mu m thickness. Pu...
Abstract: Only a few welding processes for plastics meet the special demands of microtech-nology. La...
In the presented study, the laser welding of wire to flat geometry for miniature electromechanical h...
The joining processes in electronic device manufacturing are today still dominated by conventional j...