Numerical simulations of charging and profile evolution during gate electrode overetching in high density plasmas have been performed to investigate the effect of long conductive sidewalls on profile distortion (notching). The results reveal that the angle of electron irradiance of the conductive portion of the sidewalls affects profoundly the charging potential of the gates. Larger angles, obtained for thinner masks and/or thicker polysilicon, result in reduced gate potentials which, through their influence on the local ion dynamics, cause more severe notching at all lines of the microstructure
Monte Carlo simulations of charging and profile evolution during plasma etching reveal that the subs...
In this work, a novel diagnostic tool was developed in order to provide a measurement technique for ...
While observations of charging damage during plasma-assisted deposition have been erratic thus far, ...
Numerical simulations of charging and profile evolution during gate electrode overetching in high de...
Charging and topography evolution simulations during plasma etching of high aspect ratio line-and...
Feature-scale charging simulations during gate electrode overetching in high-density plasmas reveal ...
Surface charge dissipation on insulator surfaces can reduce local charging potentials thereby preven...
The effect of aspect ratio (depth/width) on charge buildup in trenches during plasma etching of poly...
The effect of the electron temperature (Te) on charging potentials that develop in trenches during p...
The differential charging of high-aspect-ratio dense structures during plasma etching is studied by ...
Monte Carlo simulations of electron tunneling through a 3 nm gate oxide during etching of dense patt...
We present a two-dimensional Monte Carlo simulation of profile evolution during the overetching step...
Monte Carlo simulations of charging and profile evolution in patterned antenna structures during etc...
Simulations of charging and profile evolution during etching of high aspect ratio polysilicon gates ...
Monte Carlo simulations of pattern-dependent charging during interlevel dielectric (ILD) deposition ...
Monte Carlo simulations of charging and profile evolution during plasma etching reveal that the subs...
In this work, a novel diagnostic tool was developed in order to provide a measurement technique for ...
While observations of charging damage during plasma-assisted deposition have been erratic thus far, ...
Numerical simulations of charging and profile evolution during gate electrode overetching in high de...
Charging and topography evolution simulations during plasma etching of high aspect ratio line-and...
Feature-scale charging simulations during gate electrode overetching in high-density plasmas reveal ...
Surface charge dissipation on insulator surfaces can reduce local charging potentials thereby preven...
The effect of aspect ratio (depth/width) on charge buildup in trenches during plasma etching of poly...
The effect of the electron temperature (Te) on charging potentials that develop in trenches during p...
The differential charging of high-aspect-ratio dense structures during plasma etching is studied by ...
Monte Carlo simulations of electron tunneling through a 3 nm gate oxide during etching of dense patt...
We present a two-dimensional Monte Carlo simulation of profile evolution during the overetching step...
Monte Carlo simulations of charging and profile evolution in patterned antenna structures during etc...
Simulations of charging and profile evolution during etching of high aspect ratio polysilicon gates ...
Monte Carlo simulations of pattern-dependent charging during interlevel dielectric (ILD) deposition ...
Monte Carlo simulations of charging and profile evolution during plasma etching reveal that the subs...
In this work, a novel diagnostic tool was developed in order to provide a measurement technique for ...
While observations of charging damage during plasma-assisted deposition have been erratic thus far, ...