Molecular dynamics modeling of diffusion bonding

Molecular dynamics simulations on diffusion bonding of Cu-Ag showed that the thickness of the interfacial region depended on the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into crystalline structure when the structure was cooled to the room temperature. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.link_to_subscribed_fulltex