Add to ORKGRecent progress on diagnosis and characterization of defects in hybrid microelectronic components us1ng a transmission scanning acoustic microscope (SAM) operating at 150 MHz is summarized. A simple method has been established to locate (in three dimensions) and classify the defects. The study also shows that two optically identical thick-film resistors having a ratio of 5 x 103 in resistance value exhibit a 43 db contrast in acoustic amplitud
A non-destructive inspection system using 50MHz ultrasound has been developed. The system has been d...
New semiconductor chip technologies and technologies for 3D integration require information’s of pac...
The increasing demand on the complexity of microelectronic components will soon require architecture...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
ABSTRACT. Recent pr?gr~ss on diagnosis and characterization of defects in hybrid microelectronic com...
ABSTRACT. Recent pr?gr~ss on diagnosis and characterization of defects in hybrid microelectronic com...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
In manufacturing of microelectronic components, non-destructive failure analysis methods are importa...
In industrial manufacturing of microelectronic components, non-destructive failure analysis methods ...
The interfacial regions of four types of production-line microelectronic components (die-bonded tran...
The interest of the scanning acoustic microscope previously demonstrated in the biomedical field is ...
The interest of the scanning acoustic microscope previously demonstrated in the biomedical field is ...
A non-destructive inspection system using 50MHz ultrasound has been developed. The system has been d...
New semiconductor chip technologies and technologies for 3D integration require information’s of pac...
The increasing demand on the complexity of microelectronic components will soon require architecture...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
ABSTRACT. Recent pr?gr~ss on diagnosis and characterization of defects in hybrid microelectronic com...
ABSTRACT. Recent pr?gr~ss on diagnosis and characterization of defects in hybrid microelectronic com...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
Recent progress on diagnosis and characterization of defects in hybrid microelectronic components us...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for ...
Ongoing trends in microelectronics aim at continuously increasing the integration rate and complexit...
In manufacturing of microelectronic components, non-destructive failure analysis methods are importa...
In industrial manufacturing of microelectronic components, non-destructive failure analysis methods ...
The interfacial regions of four types of production-line microelectronic components (die-bonded tran...
The interest of the scanning acoustic microscope previously demonstrated in the biomedical field is ...
The interest of the scanning acoustic microscope previously demonstrated in the biomedical field is ...
A non-destructive inspection system using 50MHz ultrasound has been developed. The system has been d...
New semiconductor chip technologies and technologies for 3D integration require information’s of pac...
The increasing demand on the complexity of microelectronic components will soon require architecture...