The impact of grid-placed contacts on application-specific integrated circuit (ASIC) performance is studied. Although snapping contacts to grid adds restrictions during layout design, smaller circuit area can be achieved by careful selection of the grid pitch, raising the lower limit of transistor width, applying double exposure, and shrinking the minimum contact pitch enabled by more effective application of resolution enhancement technologies. The technique is demonstrated on the contact level of 250-nm standard cells with the minimum contact pitch shrunk by 10%. The area change of 84 cells ranges from -20% to 25% with a median decrease of 5%. The areas of two circuits, a finite-impulse-response (FIR) filter and an add-compare-select (ACS...
Continuous scaling of feature sizes in CMOS integrated circuits (IC) pushes the design performance e...
Photolithography has been a key enabler of the aggressive IC technology scaling implicit in Moore's ...
In this paper I present the impact of sub-wavelength optical lithography for new EDA tools, IC Layou...
The practicability and methodology of applying regularly placed contacts on layout design of standar...
Abstract—The practicability and methodology of applying regularly placed contacts on layout design o...
The practicability and methodology of applying resolution-enhancement- technique-driven regularly pl...
The layout strategies of standard cells with regularly-placed contacts and gates are studied. The re...
An Optical Lithography Method Is Disclosed That Uses Double Exposure Of A Reusable Template Mask And...
In this thesis, three major issues related to process variation in integrated circuits in the subwav...
Current lithography techniques use a light wavelength of 193nm to print sub-65nm features. This intr...
textStandard cells are fundamental circuit building blocks designed at very early design stages. Nan...
textStandard cells are fundamental circuit building blocks designed at very early design stages. Nan...
An optical lithography method is disclosed that uses double exposure of a reusable template mask and...
Scaling of physical dimensions faster than the optical wavelengths or equipment tolerances used in t...
An optical lithography method is disclosed that uses double exposure of a reusable a chromeless alte...
Continuous scaling of feature sizes in CMOS integrated circuits (IC) pushes the design performance e...
Photolithography has been a key enabler of the aggressive IC technology scaling implicit in Moore's ...
In this paper I present the impact of sub-wavelength optical lithography for new EDA tools, IC Layou...
The practicability and methodology of applying regularly placed contacts on layout design of standar...
Abstract—The practicability and methodology of applying regularly placed contacts on layout design o...
The practicability and methodology of applying resolution-enhancement- technique-driven regularly pl...
The layout strategies of standard cells with regularly-placed contacts and gates are studied. The re...
An Optical Lithography Method Is Disclosed That Uses Double Exposure Of A Reusable Template Mask And...
In this thesis, three major issues related to process variation in integrated circuits in the subwav...
Current lithography techniques use a light wavelength of 193nm to print sub-65nm features. This intr...
textStandard cells are fundamental circuit building blocks designed at very early design stages. Nan...
textStandard cells are fundamental circuit building blocks designed at very early design stages. Nan...
An optical lithography method is disclosed that uses double exposure of a reusable template mask and...
Scaling of physical dimensions faster than the optical wavelengths or equipment tolerances used in t...
An optical lithography method is disclosed that uses double exposure of a reusable a chromeless alte...
Continuous scaling of feature sizes in CMOS integrated circuits (IC) pushes the design performance e...
Photolithography has been a key enabler of the aggressive IC technology scaling implicit in Moore's ...
In this paper I present the impact of sub-wavelength optical lithography for new EDA tools, IC Layou...