This paper proposes Wire Sizing considering skin effect. Previous work on Wire Sizing usually uses RC model which is independent of frequency. However, as increasing operating frequency, frequencydependence of interconnect characteristics is becoming significant. Therefore, in interconnect design and analysis, frequency-dependence must be considered. By Wire Sizing considering frequencydependence, the experimental results show about 50% ~ 80% reduction of effective upper-bound wire width compared with previous work
Abstract- In this paper, two issues about wire width are investigated. The first one is that “Is the...
Abstract—This paper investigates the properties of the on-wafer interconnects built in a 0.18- m CMO...
D.Ing.The necessity of frequency selective interconnects in future integrated power electronic syste...
本稿では、表皮効果を考慮したWire Sizing を提案する。従来のWire Sizing は、周波数に依存しないRC モデルを利用した手法である。ところが、LSI の動作周波数向上に伴い、配線特性...
Since the first chip was manufactured in a CMOS technology there has been a drive to shrink dimensio...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
As the technology scales down to nanometer regime and the frequency of operation has gained the GHz ...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
Received 22-02-2012, online 01-03-2012 ABSTRACT As the interconnect technology is shrinking into nan...
As the frequency of operation has attained a range of GHz and signal rise time continues to increase...
This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several...
A compact modeling methodology for the skin effect in conduc-tors with rectangular cross section is ...
[[abstract]]Skin effects should be considered for accurate deep-submicron (DSM, 0.35mm and below) in...
In semiconductor industry, device feature dimension has been continuously scaled down to reduce devi...
As the frequency of operation has attained a range of GHz and signal rise time continues to increase...
Abstract- In this paper, two issues about wire width are investigated. The first one is that “Is the...
Abstract—This paper investigates the properties of the on-wafer interconnects built in a 0.18- m CMO...
D.Ing.The necessity of frequency selective interconnects in future integrated power electronic syste...
本稿では、表皮効果を考慮したWire Sizing を提案する。従来のWire Sizing は、周波数に依存しないRC モデルを利用した手法である。ところが、LSI の動作周波数向上に伴い、配線特性...
Since the first chip was manufactured in a CMOS technology there has been a drive to shrink dimensio...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
As the technology scales down to nanometer regime and the frequency of operation has gained the GHz ...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
Received 22-02-2012, online 01-03-2012 ABSTRACT As the interconnect technology is shrinking into nan...
As the frequency of operation has attained a range of GHz and signal rise time continues to increase...
This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several...
A compact modeling methodology for the skin effect in conduc-tors with rectangular cross section is ...
[[abstract]]Skin effects should be considered for accurate deep-submicron (DSM, 0.35mm and below) in...
In semiconductor industry, device feature dimension has been continuously scaled down to reduce devi...
As the frequency of operation has attained a range of GHz and signal rise time continues to increase...
Abstract- In this paper, two issues about wire width are investigated. The first one is that “Is the...
Abstract—This paper investigates the properties of the on-wafer interconnects built in a 0.18- m CMO...
D.Ing.The necessity of frequency selective interconnects in future integrated power electronic syste...