本稿では、表皮効果を考慮したWire Sizing を提案する。従来のWire Sizing は、周波数に依存しないRC モデルを利用した手法である。ところが、LSI の動作周波数向上に伴い、配線特性の周波数依存性が顕著に なってきている。これからの高周波回路では、周波数依存性を考慮した配線設計や解析が必要である。実験 で、提案手法は従来のRC モデルによるWire Sizing よりも50% ~ 80% 狭い配線幅を得ることができた。This paper proposes Wire Sizing considering skin effect. Previous work on Wire Sizing usually uses RC model which is independent of frequency. However, as increasing operating frequency, frequencydependence of interconnect characteristics is becoming significant. Therefore, in interconnect design and analysis, frequency-dependence must be considered. By Wire Sizing considering frequency-dependence, the experimental results show about 50% ~ 80% reduction of effective upper-bound wire width compared with previous work
[[abstract]]Skin effects should be considered for accurate deep-submicron (DSM, 0.35mm and below) in...
The 2006 International Technology Roadmap for Semiconductors projects that for 2020, interconnects w...
The article introduces methodology of lowering time and computational requirements for complex 3D fi...
This paper proposes Wire Sizing considering skin effect. Previous work on Wire Sizing usually uses R...
Since the first chip was manufactured in a CMOS technology there has been a drive to shrink dimensio...
In this paper the multiconductor cell analysis (MCA) has been applied to Milliken type cables of lar...
ストリップ線任意曲がりは、マイクロ波集積回路の実現に当たって重要な素子であり、既に、2次元近似あるいは3次元的取り扱い方が提案されている。この任意角曲がりに適当な切断を入れることにより電力透過特性が改...
Tez (Yüksek Lisans) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2001Thesis (M.Sc.) -- ...
従来、マイクロ波帯での各種ストリッブ線回路は伝送線路理論を用いて解析・合成されてきた。しかし、実際のストリップ線回路は2次元的に広がった回路となり、 1次元伝送線路としてよりも2次元的広がりを持つ平面...
Mathematical models are essential to our understanding of the electrical properties of the skin. In ...
This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
rights: 社団法人電子情報通信学会 relation: isVersionOf:http://ci.nii.ac.jp/naid/1100033209362003年電子情報通信学会エレクトロニク...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
A compact modeling methodology for the skin effect in conduc-tors with rectangular cross section is ...
[[abstract]]Skin effects should be considered for accurate deep-submicron (DSM, 0.35mm and below) in...
The 2006 International Technology Roadmap for Semiconductors projects that for 2020, interconnects w...
The article introduces methodology of lowering time and computational requirements for complex 3D fi...
This paper proposes Wire Sizing considering skin effect. Previous work on Wire Sizing usually uses R...
Since the first chip was manufactured in a CMOS technology there has been a drive to shrink dimensio...
In this paper the multiconductor cell analysis (MCA) has been applied to Milliken type cables of lar...
ストリップ線任意曲がりは、マイクロ波集積回路の実現に当たって重要な素子であり、既に、2次元近似あるいは3次元的取り扱い方が提案されている。この任意角曲がりに適当な切断を入れることにより電力透過特性が改...
Tez (Yüksek Lisans) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2001Thesis (M.Sc.) -- ...
従来、マイクロ波帯での各種ストリッブ線回路は伝送線路理論を用いて解析・合成されてきた。しかし、実際のストリップ線回路は2次元的に広がった回路となり、 1次元伝送線路としてよりも2次元的広がりを持つ平面...
Mathematical models are essential to our understanding of the electrical properties of the skin. In ...
This paper presents an extensive transistor sizing analysis for regular transistor fabrics. Several...
This paper presents a physics-based compact model for predicting high frequency performance of spira...
rights: 社団法人電子情報通信学会 relation: isVersionOf:http://ci.nii.ac.jp/naid/1100033209362003年電子情報通信学会エレクトロニク...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
A compact modeling methodology for the skin effect in conduc-tors with rectangular cross section is ...
[[abstract]]Skin effects should be considered for accurate deep-submicron (DSM, 0.35mm and below) in...
The 2006 International Technology Roadmap for Semiconductors projects that for 2020, interconnects w...
The article introduces methodology of lowering time and computational requirements for complex 3D fi...