Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band

© 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.[EN] Recently, new methodologies for manufacturing empty waveguides completely integrated in a planar substrate have been proposed in order to improve the performance of substrate-integrated devices. One of these alternatives is the so-called empty substrate-integrated waveguide (ESIW). The height of high-frequency substrates, where ESIW devices are integrated, is very small. Then, the capacity of storing energy of ESIW resonators is drastically reduced, and as a result, their quality factor is not as high as it could be with a higher ESIW. In order to overcome this restriction, a novel integrated structure is proposed to embed very high-quality factor filters based on the ESIW with an increased height. As a result, we show, in this letter, for the first time, the successful integration of an increased-height ESIW filter in a printed circuit board of 0.305 mm height at Q-band, achieving a quality factor above 1000, which is a remarkable result for a completely substrate-integrated device operating in this frequency band. When compared with the same filter manufactured with an ESIW with the same height as the substrate, the novel filter shows a measured quality factor 85% higher.This work was supported by the Ministerio de Economia y Competitividad, Spanish Government, under Project TEC2016-75934-C4-3-R and Project TEC2016-75934-C4-1-R.Martínez-Zamora, JÁ.; De Dios, JJ.; Belenguer Martínez, Á.; Esteban González, H.; Boria Esbert, VE. (2018). Integration of a Very High Quality Factor Filter in Empty Substrate Integrated Waveguide at Q-band. IEEE Microwave and Wireless Components Letters. 28(6):503-505. https://doi.org/10.1109/LMWC.2018.2833214S50350528