A melt fluxing technique has been used to undercool Ag-Cu eutectic alloy by 10 - 70 K and the subsequent recalescence has been studied using high speed imaging. An anomalous, oscillatory growth of the solidification front was observed, in which the growth front would make a series of quasi-periodic jumps separated by extended periods during which time growth appeared to arrest. Evidence of this previously unreported mode of growth is presented. The high speed images and microstructural evidence support the theory that anomalous eutectics form by the growth and subsequent remelting of eutectic dendrites
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
An undercooled melt possesses an enhanced free enthalpy that opens up the possibility to crystallize...
The solidification behaviour of Fe82Ge18 and Fe75Ge25 alloys is studied by using an electromagnetic ...
A melt encasement (fluxing) method was used to undercool Ag-Cu alloy at its eutectic composition. Th...
Quantitative electron microscopy has been used to map the distribution of anomalous eutectic within ...
A melt encasement (fluxing) method has been used to undercool Ag-Cu alloy at its eutectic compositio...
A comparative study of rapid solidification of Ag-Cu eutectic alloy processed via melt fluxing and d...
Rapid solidification processes of glass-fluxed Ni81.3Sn18.7 eutectic alloys at various undercoolings...
Rapid solidification processes of glass-fluxed Ni81.3Sn18.7 eutectic alloys at various undercoolings...
Anomalous eutectic formation in undercooled Ni–Sn alloys was investigated by in situ X-ray diffracti...
Electromagnetic levitation technique is applied to containerlessly undercool bulk samples in diamete...
Morphology and size of dendritic microstructures sensitively depend on the solidification conditions...
Electrostatic levitation has been used to deeply undercool melts of intermetallic compounds prior to...
Solidification needs an undercooling to drive the solidification front. If large undercoolings are a...
The relationship between emissivity, delay time, and surface growth for metastable solidification of...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
An undercooled melt possesses an enhanced free enthalpy that opens up the possibility to crystallize...
The solidification behaviour of Fe82Ge18 and Fe75Ge25 alloys is studied by using an electromagnetic ...
A melt encasement (fluxing) method was used to undercool Ag-Cu alloy at its eutectic composition. Th...
Quantitative electron microscopy has been used to map the distribution of anomalous eutectic within ...
A melt encasement (fluxing) method has been used to undercool Ag-Cu alloy at its eutectic compositio...
A comparative study of rapid solidification of Ag-Cu eutectic alloy processed via melt fluxing and d...
Rapid solidification processes of glass-fluxed Ni81.3Sn18.7 eutectic alloys at various undercoolings...
Rapid solidification processes of glass-fluxed Ni81.3Sn18.7 eutectic alloys at various undercoolings...
Anomalous eutectic formation in undercooled Ni–Sn alloys was investigated by in situ X-ray diffracti...
Electromagnetic levitation technique is applied to containerlessly undercool bulk samples in diamete...
Morphology and size of dendritic microstructures sensitively depend on the solidification conditions...
Electrostatic levitation has been used to deeply undercool melts of intermetallic compounds prior to...
Solidification needs an undercooling to drive the solidification front. If large undercoolings are a...
The relationship between emissivity, delay time, and surface growth for metastable solidification of...
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic pack...
An undercooled melt possesses an enhanced free enthalpy that opens up the possibility to crystallize...
The solidification behaviour of Fe82Ge18 and Fe75Ge25 alloys is studied by using an electromagnetic ...