Electron transport properties of thin copper films. I.

The thickness dependence at 300 and 80 K of the electrical resistivity and its temperature coefficient, Hall coefficient, mobility, and thermoelectric power of as-deposited and annealed thin (< 1000 Å) evaporated polycrystalline copper films and films deposited at elevated temperatures have been studied. All transport parameters in carefully prepared and well-characterized films exhibit monotonically increasing size effects with decreasing film thickness. Both annealing and deposition at elevated temperatures cause considerable reduction of the "apparent" size effects in all the transport parameters of the room-temperature deposited films. A critical analysis of the observed size effects shows that the data in all cases depart markedly from the predictions of the Fuchs-Sondheimer theory (and also that of the Mayadas-Shatzkes theory which takes into account the grain boundary surface scattering). The departure from theory is different for each transport parameter. The annealing studies show that the enhanced size effects are due to the presence of a large concentration of structural defects in the films. The observed behavior may be understood by assuming the large concentration of point and/or line defects to decrease with film thickness and with annealing as well as deposition of films at elevated temperatures. The thermopower data suggest strongly that the large concentration of defects causes distortion of the Fermi surface and thereby a strong energy dependence of the mfp or relaxation time at the Fermi surface