In the present work, the microscale curing performance of two epoxy resin systems was investigated. It was shown that the degree to which these resins formed cured axisymmetric droplets suitable for microbond testing was influenced by the inclusion of a roomerature pre-cure stage. Immediate curing at elevated temperature of these systems resulted in the formation of under-cured, soft droplets that deformed under loading. The introduction of a protracted room temperature standing time increased the apparent interfacial shear strength substantially. Fourier-transform infrared spectra generated by a novel technique allowed for the glass transition temperature of microdroplet samples to be determined and detected deviations from stoichiometry. ...
Epoxy thermosets are important engineering materials with applications in coating, adhesives, packag...
This work deals with developing a self-healing resin designed for aeronautical and aerospace applica...
The fluorescence response of the dansyl chromophore has been used to study the kinetic of epoxy curi...
The curing performance of two epoxy resin systems has been investigated using the microbond test and...
Users of the microbond test largely assume that the properties of a microbond resin droplet are esse...
This paper focuses on the cure shrinkage and the thermomechanical properties of an amine cured epoxy...
The development of a novel hot-stage microscopy technique to measure the level of cure shrinkage tha...
Near-infrared spectroscopy was used to quantify the cure reaction of 4,4'-methylene-bis-(2,6-diethyl...
In studies of the fibre-matrix interphase with microscale single fibre methods, the dependence of re...
In this paper, steady-state fluorescence spectroscopy is used to investigate the curing of two-compo...
Despite numerous studies on thermoset resin systems, understanding of the influence of chemical netw...
Dielectric analysis (DEA) is an effective method for monitoring the curing process of epoxy resin (E...
As a measure of the degree of curing of epoxy resins, the glass transition temperature, Tg, and the ...
The method described can be used to observe the cure in epoxy resins, it is a sensor to serve as an...
Click on the DOI link to access the article (may not be free).The interfacial shear strength (IFSS) ...
Epoxy thermosets are important engineering materials with applications in coating, adhesives, packag...
This work deals with developing a self-healing resin designed for aeronautical and aerospace applica...
The fluorescence response of the dansyl chromophore has been used to study the kinetic of epoxy curi...
The curing performance of two epoxy resin systems has been investigated using the microbond test and...
Users of the microbond test largely assume that the properties of a microbond resin droplet are esse...
This paper focuses on the cure shrinkage and the thermomechanical properties of an amine cured epoxy...
The development of a novel hot-stage microscopy technique to measure the level of cure shrinkage tha...
Near-infrared spectroscopy was used to quantify the cure reaction of 4,4'-methylene-bis-(2,6-diethyl...
In studies of the fibre-matrix interphase with microscale single fibre methods, the dependence of re...
In this paper, steady-state fluorescence spectroscopy is used to investigate the curing of two-compo...
Despite numerous studies on thermoset resin systems, understanding of the influence of chemical netw...
Dielectric analysis (DEA) is an effective method for monitoring the curing process of epoxy resin (E...
As a measure of the degree of curing of epoxy resins, the glass transition temperature, Tg, and the ...
The method described can be used to observe the cure in epoxy resins, it is a sensor to serve as an...
Click on the DOI link to access the article (may not be free).The interfacial shear strength (IFSS) ...
Epoxy thermosets are important engineering materials with applications in coating, adhesives, packag...
This work deals with developing a self-healing resin designed for aeronautical and aerospace applica...
The fluorescence response of the dansyl chromophore has been used to study the kinetic of epoxy curi...