FinFET and Ultra Thin Body and BOX (UTBB) Silicon-on-Insulator (SOI) MOSFETs are the most promising advanced devices to fulfill the International Technology Roadmap for Semiconductors (ITRS) requirements. Both devices have been intensively studied these last years. Most of the reported data concern their digital performance. In this paper, their analog/RF behavior is described and compared. Both show pretty similar characteristics in terms of transconductance, Early voltage, voltage gain, self-heating issue but UTBB outperforms FinFET in terms of cutoff frequencies thanks to their relatively lower fringing parasitic capacitances
During last decades, CMOS technology scaling down has enabled high frequency operation up to mm-W an...
This work presents a comparison of parasitic elements (capacitances and resistances) in a view of th...
In this work, we report on the significance of underlap channel architecture in Ultra Thin Body BOX ...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
This work provides a detailed study of 28 nm fully-depleted silicon-on-insulator (FD-SOI) planar ult...
In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin ...
This work provides a detailed study of 28 nm fully depleted silicon-on-insulator (FD SOI) ultra-thin...
In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin ...
In summary, we have compared SOI and BOI FinFET device characteristics and the performance of digita...
Performance of RF integrated circuit (IC) is directly linked to the analogue and high frequency char...
The DC and RF performance of thin body GOI and SOI MOSFETs are investigated through simulation. The ...
Ultra-Thin Body and Box (UTBB) Fully-depleted Silicon-on-Insulator (FDSOI) MOSFETs exhibit very high...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
During last decades, CMOS technology scaling down has enabled high frequency operation up to mm-W an...
This work presents a comparison of parasitic elements (capacitances and resistances) in a view of th...
In this work, we report on the significance of underlap channel architecture in Ultra Thin Body BOX ...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
This work provides a detailed study of 28 nm fully-depleted silicon-on-insulator (FD-SOI) planar ult...
In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin ...
This work provides a detailed study of 28 nm fully depleted silicon-on-insulator (FD SOI) ultra-thin...
In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin ...
In summary, we have compared SOI and BOI FinFET device characteristics and the performance of digita...
Performance of RF integrated circuit (IC) is directly linked to the analogue and high frequency char...
The DC and RF performance of thin body GOI and SOI MOSFETs are investigated through simulation. The ...
Ultra-Thin Body and Box (UTBB) Fully-depleted Silicon-on-Insulator (FDSOI) MOSFETs exhibit very high...
Performance of RF integrated circuit (IC) is directly linked to the analog and high frequency charac...
During last decades, CMOS technology scaling down has enabled high frequency operation up to mm-W an...
This work presents a comparison of parasitic elements (capacitances and resistances) in a view of th...
In this work, we report on the significance of underlap channel architecture in Ultra Thin Body BOX ...