A method is presented, based on photothermal ionization spectroscopy (PTIS), for determining the shallow minority‐acceptor concentration in multiply doped silicon, over the concentration range 1013/cm3–1015/cm3. The method is an extension of a model developed previously for the PTIS response in a multiply doped semiconductor, which accounts for the experimentally observed change in signature, from negative to positive, of the lower‐energy lines of the deeper acceptor as the temperature is increased. It uses a calculated curve of the dependence on the shallow‐acceptor concentration of the temperature at which the change in signature occurs, for a given line, and compares it to a determination of this temperature from actual spectra for the s...
We present a method for measuring the concentrations of ionized acceptors and donors in compensated ...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
The trend for decreasing geometries within CMOS architecture is driving the need for ever shallower,...
A method is presented, based on photothermal ionization spectroscopy (PTIS), for determining the sha...
Low temperature microphotoluminescence spectroscopy (μ-PLS) is employed to determine the inhomogeneo...
This paper introduces a photoluminescence-based technique for determining the acceptor concentration...
Due to the small concentration of impurities normally present in semiconductors these impurity conce...
Temperature dependent majority charge carrier concentration and impurity concentration calc...
In boron-doped silicon, optical absorption takes place through the excitation of bound holes from th...
International audienceNowadays, compensated silicon (Si) is used in photovoltaic (PV) processes, whe...
The reduction in acceptor concentration due to electron irradiation is determined from C-V character...
Optical and electrical techniques are used to characterise deep- levels in silicon that could have a...
AbstractNowadays, compensated silicon (Si) is used in photovoltaic (PV) processes, whether it is thr...
AbstractThis paper presents findings on applying physical models in the literature to describe silic...
A method will be presented, which allows the quantitative determination of distributions of single v...
We present a method for measuring the concentrations of ionized acceptors and donors in compensated ...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
The trend for decreasing geometries within CMOS architecture is driving the need for ever shallower,...
A method is presented, based on photothermal ionization spectroscopy (PTIS), for determining the sha...
Low temperature microphotoluminescence spectroscopy (μ-PLS) is employed to determine the inhomogeneo...
This paper introduces a photoluminescence-based technique for determining the acceptor concentration...
Due to the small concentration of impurities normally present in semiconductors these impurity conce...
Temperature dependent majority charge carrier concentration and impurity concentration calc...
In boron-doped silicon, optical absorption takes place through the excitation of bound holes from th...
International audienceNowadays, compensated silicon (Si) is used in photovoltaic (PV) processes, whe...
The reduction in acceptor concentration due to electron irradiation is determined from C-V character...
Optical and electrical techniques are used to characterise deep- levels in silicon that could have a...
AbstractNowadays, compensated silicon (Si) is used in photovoltaic (PV) processes, whether it is thr...
AbstractThis paper presents findings on applying physical models in the literature to describe silic...
A method will be presented, which allows the quantitative determination of distributions of single v...
We present a method for measuring the concentrations of ionized acceptors and donors in compensated ...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
The trend for decreasing geometries within CMOS architecture is driving the need for ever shallower,...