To solve the problem of excessive heat accumulation in the electronic packaging field, a novel series of hybrid filler (BN@CNT) with a hierarchical “line-plane” structure was assembled via a condensation reaction between functional boron nitride(f-BN) and acid treated carbon nanotubes (a-CNTs). The reactions with different mass ratios of BN and CNTs and the effect of the obtained hybrid filler on the composites’ thermal conductivity were studied. According to the results, BN@15CNT exhibited better effects on promoting thermal conductivity of polybenzoxazine(PBz) composites which were prepared via ball milling and hot compression. The thermally conductive coefficient value of PBz composites, which were loaded with 25 wt% of BN@15CNT hybrid f...
Abstract Despite the ever-increasing demand of nanofillers for thermal enhancement of polymer compos...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
Due to the need for thermally resistant materials in microelectronic insulators, high-speed aircraft...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
The reaction heat decreased with the increase of BN@2Cu hybrid fillers The onset of polymerization e...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical pr...
In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN)...
International audiencePolymers are thermally insulating materials, which limits their use in some sp...
The controlled assembly of micro- and nano-ceramic fillers in polymer nanocomposites provides robust...
Abstract Despite the ever-increasing demand of nanofillers for thermal enhancement of polymer compos...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
Due to the need for thermally resistant materials in microelectronic insulators, high-speed aircraft...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
The development of thermal conduction polymer-based composites is important to solve the heat dissip...
The reaction heat decreased with the increase of BN@2Cu hybrid fillers The onset of polymerization e...
This work placed an emphasis that constructing segregated boron nitride (BN)/carbon nanotube (CNT) h...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
In order to improve the thermal conductivity of 30 wt % synthetic graphite (SG)-filled polyketones (...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical pr...
In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN)...
International audiencePolymers are thermally insulating materials, which limits their use in some sp...
The controlled assembly of micro- and nano-ceramic fillers in polymer nanocomposites provides robust...
Abstract Despite the ever-increasing demand of nanofillers for thermal enhancement of polymer compos...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
Due to the need for thermally resistant materials in microelectronic insulators, high-speed aircraft...