Experimental Studies of Sealing Mechanism of a Dismountable Microsystem‑to‑Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature

As fluidic microelectromechanical devices are developing and often attached to, or embedded in, large, complex and expensive systems, the issues of modularity, maintenance and subsystem replacement arise. In this work, a robust silicon connector suitable for high-pressure applications – likely with harsh fluids – in the temperature range of +100 to –100°C is demonstrated and tested together with a stainless steel nipple representing a simple and typical macropart. With a micromachined circular membrane equipped with a 5 μm high ridge, this connector is able to maintain a leak rate below 2.0´10-8 scc/s of gaseous helium with a pressure of up to 9.7 bar. Degradation of the sealing performance on reassembly is associated with the indentation of the ridge. However, the ridge makes the sealing interface less sensitive to particles in comparison with a flat reference. Most evaluation is made through so called heat-until-leak tests conducted to determine the maximum working temperature and the sealing mechanism of the connector. A couple of these are followed by cryogenic testing. The effect of thermal mismatch of the components is discussed and utilized as an early warning mechanism