© 2018 by the authors. In this study, for the first time, the effect of large non-monotonic simple shear strains on the uniformity of the tensile properties of pure Cu specimens was studied and justified by means of microstructural and textural investigations. A process called simple shear extrusion, which consists of two forward and two reversed simple shear straining stages on two different slip planes, was designed in order to impose non-monotonic simple shear strains. Although the mechanism of grain refinement is continuous dynamic recrystallization, an exceptional microstructural behavior and texture were observed due to the complicated straining path results from two different slip planes and two pairs of shear directions on two diffe...
Texture and microstructural evolution of interstitial-free (IF) steel and copper (Cu) subjected to ...
In this study, coarse-grained copper sheets were subjected to tension-rolling and rolling-tension st...
Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copp...
In this study, for the first time, the effect of large non-monotonic simple shear strains on the uni...
A Cu-Cu multilayer processed by accumulative roll bonding was deformed to large strains and further ...
A recently developed severe plastic deformation technique, cyclic expansion-extrusion (CEE), was app...
The aim of this paper was to examine the gradient in the microstructure and texture that develops du...
Deformation microstructures in two batches of commercially pure copper (A and B) of allnost similar ...
In this work the microstructural features of pure copper were studied using two methods of severe pl...
Experiments were performed to analyze the microstructural evolution and mechanical behavior of comme...
Experiments were performed to analyze the microstructural evolution and mechanical behavior of comme...
During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, i...
Surface mechanical treatments are known to introduce deformation heterogeneity, thus entailing a com...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
The evolution of microstructure and texture gradient in warm Accumulative Roll Bonded Cu-Cu multilay...
Texture and microstructural evolution of interstitial-free (IF) steel and copper (Cu) subjected to ...
In this study, coarse-grained copper sheets were subjected to tension-rolling and rolling-tension st...
Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copp...
In this study, for the first time, the effect of large non-monotonic simple shear strains on the uni...
A Cu-Cu multilayer processed by accumulative roll bonding was deformed to large strains and further ...
A recently developed severe plastic deformation technique, cyclic expansion-extrusion (CEE), was app...
The aim of this paper was to examine the gradient in the microstructure and texture that develops du...
Deformation microstructures in two batches of commercially pure copper (A and B) of allnost similar ...
In this work the microstructural features of pure copper were studied using two methods of severe pl...
Experiments were performed to analyze the microstructural evolution and mechanical behavior of comme...
Experiments were performed to analyze the microstructural evolution and mechanical behavior of comme...
During dynamic tensile extrusion (DTE) the material is subjected to a complex deformation history, i...
Surface mechanical treatments are known to introduce deformation heterogeneity, thus entailing a com...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
The evolution of microstructure and texture gradient in warm Accumulative Roll Bonded Cu-Cu multilay...
Texture and microstructural evolution of interstitial-free (IF) steel and copper (Cu) subjected to ...
In this study, coarse-grained copper sheets were subjected to tension-rolling and rolling-tension st...
Samples of oxygen-free high conductivity (OFHC) coarse-grained (CG) and ultrafine-grained (UFG) copp...