Though graphene paper consisting of layer-by-layer stacked graphene nanosheets (GNs) has been widely used as a heat spreader due to the high in-plane thermal conductivity, the drawback of graphene paper is that it shows low through-plane thermal conductivity at the same time. In this study, polyamine-functionalized perylene bisimide derivative (APBI)/graphene nanosheet hybrid paper (AGP) samples with a "brick-and-mortar" structure were fabricated via the noncovalent functionalization of GNs and APBI. APBI can not only greatly improve the through-plane thermal transport but it also improves the mechanical properties of AGP. The through-plane thermal conductivity of AGP reaches 6.67 W m(-1) K-1 with 42.36 wt% APBI and the tensile strength of ...
In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal man...
In order to overcome thermal resistance issues in polymeric matrix composites, self-standing graphen...
According to Moore\u27s Laws, complexity and power densities of electronic devices are increased dur...
With the increasing integration of devices in electronics fabrication, there are growing demands for...
Thermally conductive nanopapers fabricated from graphene and related materials are currently showing...
In this study, an innovative thermal interface material (TIM) paper based on a composite of cellulos...
Macroscopic assembly of graphene into 2D films or paper is a new form of graphene which utilizes its...
International audienceIt is demonstrated that a graphene-based film (GBF) functionalized with silane...
We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functi...
In this work, in-plane thermal conductivity measurement was carried out on graphene-based papers. Gr...
Graphene shows great potential for applications in electronics due to its outstanding physical prope...
Graphene-based papers have recently triggered considerable interests in developing the application a...
Tailoring Thermal Transport Properties of Graphene Paper by Structural Engineerin
In-plane alignment of graphene nanoplatelets (GNPs) in thin thermal interface material layers suppre...
Fast growing power densities of modern electronic devices demand high-performance thermal interface ...
In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal man...
In order to overcome thermal resistance issues in polymeric matrix composites, self-standing graphen...
According to Moore\u27s Laws, complexity and power densities of electronic devices are increased dur...
With the increasing integration of devices in electronics fabrication, there are growing demands for...
Thermally conductive nanopapers fabricated from graphene and related materials are currently showing...
In this study, an innovative thermal interface material (TIM) paper based on a composite of cellulos...
Macroscopic assembly of graphene into 2D films or paper is a new form of graphene which utilizes its...
International audienceIt is demonstrated that a graphene-based film (GBF) functionalized with silane...
We studied the heat-spreading enhancement of supported few-layer graphene by inserting silane-functi...
In this work, in-plane thermal conductivity measurement was carried out on graphene-based papers. Gr...
Graphene shows great potential for applications in electronics due to its outstanding physical prope...
Graphene-based papers have recently triggered considerable interests in developing the application a...
Tailoring Thermal Transport Properties of Graphene Paper by Structural Engineerin
In-plane alignment of graphene nanoplatelets (GNPs) in thin thermal interface material layers suppre...
Fast growing power densities of modern electronic devices demand high-performance thermal interface ...
In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal man...
In order to overcome thermal resistance issues in polymeric matrix composites, self-standing graphen...
According to Moore\u27s Laws, complexity and power densities of electronic devices are increased dur...